N,N'-1,4-phenylenebis[4-(2,5-dihydro-2,5-dioxo-1H-pyrrol-1-yl)]benzamide | 138896-00-1

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: N,N'-1,4-phenylenebis[4-(2,5-dihydro-2,5-dioxo-1H-pyrrol-1-yl)]benzamide
• 英文别名: 4-(2,5-dioxopyrrol-1-yl)-N-[4-[[[4-(2,5-dioxopyrrol-1-yl)phenyl]-hydroxymethylidene]amino]phenyl]benzenecarboximidic acid
• CAS: 138896-00-1
• 化学式: C₂₈H₁₈N₄O₆
• 分子量: 506.474
• InChiKey: VHUKJKSEWUCLDW-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  1.8
• 重原子数：
  38
• 可旋转键数：
  6
• 环数：
  5.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  133
• 氢给体数：
  2
• 氢受体数：
  6

反应信息

• 作为产物：
  描述：

  对氨基苯甲酸 在 吡啶 作用下， 以 二氯甲烷 、 丙酮 为溶剂， 反应 3.5h， 生成 N,N'-1,4-phenylenebis[4-(2,5-dihydro-2,5-dioxo-1H-pyrrol-1-yl)]benzamide
  参考文献：
  名称：

  The synthesis and characterisation of reactive poly(p-phenylene terephthalamide)s: A route towards compression stable aramid fibres

  摘要：

  Herein we report on the synthesis of reactive poly(p-phenylene terephthalamide) (PPTA) oligomers and the preparation and characterisation of aramid fibres thereof. Methacrylate and maleimide reactive end-groups were found to be sufficiently stable in H2SO4 at 85 degrees C and they were used to prepare reactive PPTA oligomers. Lyotropic spin-dopes could be prepared with up to 20 wt% of reactive oligomer (M-n = 3900 g mol(-1)) and this modification did not interfere with the fibre spinning process and had no effect on the fibre tensile properties. The as-spun fibres did indeed show a modest (+0.1 GPa) improvement in compression strength. A high temperature treatment at 380 degrees C resulted in fibres which all show a significant increase in compressive strength over their as-spun precursors, i.e. from 0.7 to 0.9 GPa. When fibres were treated at 430 degrees C the compression values of the oligomer-modified fibres dropped somewhat, whereas unmodified PPTA displayed a compressive strength of 1.1 GPa. Other favourable fibre properties such as modulus and tenacity were not compromised. (C) 2010 Elsevier Ltd. All rights reserved.

  DOI：

  10.1016/j.polymer.2010.03.015

文献信息

• COMPOSITION FOR PRODUCING A BOARD AND PRINTED CIRCUIT BOARD USING THE SAME
  申请人：KIM Kwang Hee

  公开号：US20100139961A1

  公开（公告）日：2010-06-10

  A composition, including a liquid crystal polymer or oligomer having a terminal hydroxyl group, and a cross-linking agent including a bismaleimide compound, an epoxy resin or a combination thereof, wherein the liquid crystal polymer or oligomer is represented by Formula 1: Z 1 -(R 1 ) m —(R 2 ) n -Z 2 (1), wherein R 1 is represented by Formula 2: —X 1 —Ar 1 —Y 1 —  (2), wherein X 1 and Y 1 are each independently selected from the group consisting of O, CO and NR″, in which R″ is independently selected from the group consisting of a hydrogen atom, a substituted or unsubstituted C 1 -C 20 alkyl group, and a substituted or unsubstituted C 6 -C 30 aryl group, and Ar 1 includes at least one divalent aromatic or alicyclic organic group selected from the group consisting of Formula 3:

  本发明涉及一种组合物，包括具有端羟基的液晶聚合物或寡聚物以及包括双马来酰亚胺化合物、环氧树脂或其组合物的交联剂。其中，液晶聚合物或寡聚物由式1表示：Z1-(R1)m—(R2)n-Z2(1)，其中R1由式2表示：—X1—Ar1—Y1—  (2)，其中X1和Y1各自独立地选自O、CO和NR″的群，其中R″独立地选自氢原子、取代或未取代的C1-C20烷基和取代或未取代的C6-C30芳基的群，而Ar1包括至少一种从式3所选的双价芳香或脂环有机基团：
• THERMOSETTING RESIN COMPOSITION AND BOARD USING THE SAME
  申请人：CHO Chung-Kun

  公开号：US20100159231A1

  公开（公告）日：2010-06-24

  Disclosed is a thermosetting resin composition including a thermosetting aromatic oligomer represented by the following Chemical Formula 1, a hollow particle, and solvent, and a board comprising the same. In the above Chemical Formula 1, wherein B, L 1 , L 2 , Z 1 and Z 2 are the same as in defined in the specification.
• THERMOSETTING COMPOSITION AND PRINTED CIRCUIT BOARD USING THE SAME
  申请人：JUNG Myung-Sup

  公开号：US20110235292A1

  公开（公告）日：2011-09-29

  Disclosed are a thermosetting composition including a liquid crystal oligomer, a bismaleimide-based compound, an epoxy compound, and a fluorinated polymer resin powder. A resin cured product, board, and storage medium each include the thermosetting composition.
• RESIN COMPOSITION
  申请人：CUBICURE GMBH

  公开号：US20210395420A1

  公开（公告）日：2021-12-23

  A resin composition for three dimensional printing at elevated temperatures forming high temperature-resistant materials, the resin composition comprising a heat curable component A having one or more chemical species chosen from the group comprised of monomers and/or oligomers and/or prepolymers of maleimide derivatives according to formula and a light-curable component B having one or more chemical species chosen from the group comprised of (meth)acrylate, (meth)acrylamide, vinyl esters, vinyl ether, vinyl, allyl, alkinyl or styrenic compounds as well as derivatives thereof substituted with at least one molecule from the group from which component A is chosen, wherein the amount of component A ranges from 30 wt % to 95 wt % based on the total weight of components A and B and the amount of the light-curable component B ranges from 5 to 70 wt %, based on the total weight of components A and B.
• US8512596B2
  申请人：——

  公开号：US8512596B2

  公开（公告）日：2013-08-20