A series of curing agents are provided. The curing agents are multi-functional and phosphorus-containing. The curing agents have excellent processability to be used as an epoxy resin curing agent. The curing agents can be cured to obtain a phosphorus-containing epoxy thermoset with flame retardancy characteristic. The epoxy thermosets are very fit for circuit board substrate having high glass transition temperature; semiconductor packaging material; and related materials.
提供了一系列固化剂。这些固化剂是多功能的,含
磷。这些固化剂具有优良的加工性,可用作环氧
树脂的固化剂。这些固化剂可以固化,得到具有阻燃特性的含
磷环氧热固性材料。这些环氧热固性材料非常适合具有高
玻璃转变温度的电路板基板;半导体封装材料;以及相关材料。