THERMOSETTING RESIN COMPOSITION, CURED PRODUCT THEREOF, ACTIVE ESTER RESIN, SEMICONDUCTOR SEALING MATERIAL, PREPREG, PRINTED CIRCUIT BOARD, AND BUILD-UP FILM
申请人:DIC Corporation
公开号:EP2589625A1
公开(公告)日:2013-05-08
The present invention provides a thermosetting resin composition exhibiting excellent heat resistance and flame retardancy while maintaining a low dielectric constant and low dielectric loss tangent when formed into a cured product, a cured product thereof, an active ester resin which develops these properties, and a semiconductor encapsulating material, a prepreg, a circuit board, and a build-up film which are produced using the composition. A thermosetting resin composition contains an active ester resin (A) and an epoxy resin (B) as essential components, the active ester resin (A) having a resin structure which includes a polyaryleneoxy structure (I) and in which aromatic carbon atoms in a plurality of the polyaryleneoxy structures (I) are linked through a structural site (II) represented by a structural formula 1 (wherein Ar represents a phenylene group, a phenylene group nuclear-substituted by 1 to 3 alkyl groups each having 1 to 4 carbon atoms, a naphthylene group, or a naphthylene group nuclear-substituted by 1 to 3 alkyl groups each having 1 to 4 carbon atoms).
本发明提供了一种热固性树脂组合物,该组合物在形成固化物时具有优异的耐热性和阻燃性,同时还能保持低介电常数和低介电损耗正切,本发明还提供了一种固化物、一种具有这些特性的活性酯树脂,以及使用该组合物生产的半导体封装材料、预浸料、电路板和积层膜。一种热固性树脂组合物含有活性酯树脂(A)和环氧树脂(B)作为基本成分,活性酯树脂(A)具有包括聚芳氧基结构(I)的树脂结构,其中多个聚芳氧基结构(I)中的芳香族碳原子通过结构式 1 所表示的结构位点(II)连接(其中 Ar 代表苯基、被 1 至 3 个各具有 1 至 4 个碳原子的烷基核取代的亚苯基、萘基或被 1 至 3 个各具有 1 至 4 个碳原子的烷基核取代的萘基)。