terephthaldehyde bis(4-methyl benzenimine) | 121739-50-2

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: terephthaldehyde bis(4-methyl benzenimine)
• CAS: 121739-50-2
• 化学式: C₂₂H₂₀N₂
• 分子量: 312.414
• InChiKey: ROQLXPPNAATARP-DFEHQXHXSA-N

物化性质

• 沸点：
  491.0±45.0 °C(Predicted)
• 密度：
  1.01±0.1 g/cm3(Predicted)

计算性质

• 辛醇/水分配系数(LogP)：
  5.8
• 重原子数：
  24.0
• 可旋转键数：
  4.0
• 环数：
  3.0
• sp3杂化的碳原子比例：
  0.09
• 拓扑面积：
  24.72
• 氢给体数：
  0.0
• 氢受体数：
  2.0

文献信息

• COMPOSITION FOR HEAT-DISSIPATION MEMBERS, HEAT-DISSIPATION MEMBER, AND ELECTRONIC DEVICE
  申请人：JNC Corporation

  公开号：EP3141589A1

  公开（公告）日：2017-03-15

  The invention of the present application refers to a composition capable of forming a heat-dissipation member having high thermal conductivity, and a heat-dissipation member. The composition for the heat-dissipation member of the present application contains a polymerizable liquid crystal compound having, at both terminals, a structure including an oxiranyl group or an oxetanyl group; a curing agent that cures the polymerizable liquid crystal compound; and an inorganic filler formed of nitride. A curing temperature of the composition for the heat-dissipation member is within or higher than the temperature range in which the polymerizable liquid crystal compound exhibits a liquid crystal phase, and within or lower than the temperature range in which the polymerizable liquid crystal compound exhibits an isotropic phase. The heat-dissipation member formed of such a composition can have excellent thermal conductivity owing to a synergistic effect between alignment of the liquid crystal compound and the inorganic filler formed of nitride.

  本申请的发明涉及一种能够形成具有高导热性的散热部件的组合物和一种散热部件。本申请的热耗散构件组合物包含一种可聚合液晶化合物，其两端具有包括环氧乙烷基团或环氧乙烷基团的结构；一种固化剂，用于固化可聚合液晶化合物；以及一种由氮化物形成的无机填料。用于热耗散部件的组合物的固化温度在可聚合液晶化合物呈现液晶相的温度范围内或高于该温度范围，并且在可聚合液晶化合物呈现各向同性相的温度范围内或低于该温度范围。由于液晶化合物的排列与氮化物形成的无机填料之间的协同效应，由这种组合物形成的散热部件可以具有极佳的导热性。
• Composition for heat-dissipation members, heat-dissipation member, electronic device, and method of producing heat dissipating member
  申请人：JNC CORPORATION

  公开号：US10202530B2

  公开（公告）日：2019-02-12

  The present invention relates to a composition capable of forming a heat dissipating member having high thermal conductivity and a heat dissipating member. The composition for a heat dissipating member of the present invention is a composition for a heat dissipating member that includes a first inorganic filler having thermal conductivity that is bonded to one end of a coupling agent; a second inorganic filler having thermal conductivity that is bonded to one end of a coupling agent, in which a bifunctional or higher polymerizable compound is additionally bonded to the other end of the bonded coupling agent; wherein the other end of the coupling agent bonded to the first inorganic filler is to be bonded to the polymerizable compound on the second inorganic filler during curing.

  本发明涉及一种能够形成具有高导热性的散热构件和散热构件的组合物。本发明的散热部件组合物是一种用于散热部件的组合物，它包括与耦合剂一端粘合的具有热传导性的第一种无机填料；具有热传导性的第二种无机填料，该填料与偶联剂的一端粘合，其中双官能团或更高的可聚合化合物另外与粘合偶联剂的另一端粘合；其中与第一种无机填料粘合的偶联剂的另一端在固化过程中与第二种无机填料上的可聚合化合物粘合。
• LIQUID CRYSTAL MATERIAL OF SMECTIC PHASE IN HIGH SCATTERING STATE AND DISPLAY DEVICE THEREOF
  申请人：Halation Photonics Corporation

  公开号：EP2799516B1

  公开（公告）日：2019-02-20
• COMPOSITION FOR HEAT-DISSIPATION MEMBERS, HEAT-DISSIPATION MEMBER, ELECTRONIC DEVICE, AND HEAT-DISSIPATION-MEMBER PRODUCTION METHOD
  申请人：JNC CORPORATION

  公开号：US20170306207A1

  公开（公告）日：2017-10-26

  The present invention relates to a composition capable of forming a heat dissipating member having high thermal conductivity and a heat dissipating member. The composition for a heat dissipating member of the present invention is a composition for a heat dissipating member that includes a first inorganic filler having thermal conductivity that is bonded to one end of a coupling agent; a second inorganic filler having thermal conductivity that is bonded to one end of a coupling agent, in which a bifunctional or higher polymerizable compound is additionally bonded to the other end of the bonded coupling agent; wherein the other end of the coupling agent bonded to the first inorganic filler is to be bonded to the polymerizable compound on the second inorganic filler during curing.
• COMPOSITION FOR LOW THERMAL EXPANSION MEMBERS, LOW THERMAL EXPANSION MEMBER, ELECTRONIC DEVICE, AND METHOD FOR PRODUCING LOW THERMAL EXPANSION MEMBER
  申请人：JNC CORPORATION

  公开号：US20190055444A1

  公开（公告）日：2019-02-21

  The present invention provides: a composition for low thermal expansion members, which is capable of forming a low thermal expansion member that has a thermal expansion coefficient close to those of the members within a semiconductor element, while having high heat resistance and high heat conductivity; and a low thermal expansion member. A composition for low thermal expansion members according to the present invention is characterized by containing: a heat conductive first inorganic filler that is bonded to one end of a first coupling agent; and a heat conductive second inorganic filler that is bonded to one end of a second coupling agent. This composition for low thermal expansion members is also characterized in that the first inorganic filler and the second inorganic filler are bonded to each other via the first coupling agent and the second coupling agent by means of a curing treatment.