申请人:Hughes Aircraft Company
公开号:US04537974A1
公开(公告)日:1985-08-27
A diethynylated phenylbenzimidazole compound having the formula: ##STR1## where Y is phenyl, cyclohexyl, adamantyl or phenoxylatedphenyl of the formula C.sub.6 H.sub.5 (OC.sub.6 H.sub.4)n (n=1 to 3) and where R1, R2 and R3 are ethynyl, phenoxyethynyl, phenylethynyl, or hydrogen, and further wherein at least one of said R1, R2 or R3 is not hydrogen. The compounds can be cured to form thermoset polymers which are stable at temperatures above 300.degree. C.
一种二乙炔基苯并咪唑化合物,化学式为:##STR1## 其中Y为苯基,环己基,金刚烷基或苯氧基苯基,化学式为C.sub.6 H.sub.5 (OC.sub.6 H.sub.4)n (n=1至3),R1、R2和R3为乙炔基、苯氧乙炔基、苯基乙炔基或氢,其中至少有一个R1、R2或R3不是氢。该化合物可以固化形成热固性聚合物,其在300℃以上的温度下稳定。