3-(1-methyl-1H-tetrazole-5-ylthio)propane-1-sulfonic acid | 1449112-64-4

• 分子结构分类: 有机化合物 - 有机硫化合物 - 硫醚类
• 英文名称: 3-(1-methyl-1H-tetrazole-5-ylthio)propane-1-sulfonic acid
• 英文别名: 3-(1-methyltetrazol-5-yl)sulfanylpropane-1-sulfonic acid
• CAS: 1449112-64-4
• 化学式: C₅H₁₀N₄O₃S₂
• 分子量: 238.291
• InChiKey: WJYXVEJPUOSIFM-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  -0.3
• 重原子数：
  14
• 可旋转键数：
  5
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.8
• 拓扑面积：
  132
• 氢给体数：
  1
• 氢受体数：
  7

反应信息

• 作为产物：
  描述：

  1-甲基-5-巯基-1H-四氮唑 以 乙腈 为溶剂， 以68%的产率得到3-(1-methyl-1H-tetrazole-5-ylthio)propane-1-sulfonic acid
  参考文献：
  名称：

  ALKYL SULFONATED TETRAZOLE COMPOUND, PREPARING METHOD THEREOF, AND EPOXY RESIN CONTAINING THE SAME, AND SUBSTRATE PRODUCED THEREFROM

  摘要：

  本发明提供了一种烷基磺酸四唑化合物、其制备方法、含有该化合物的环氧树脂以及由其制备的基板。该环氧树脂通常用作印刷电路板的原材料，具有与金属的高粘附性。

  公开号：

  US20130209760A1

文献信息

• RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD, INSULATING FILM, PREPREG, AND PRINTED CIRCUIT BOARD
  申请人：SAMSUNG ELECTRO-MECHANICS CO., LTD.

  公开号：US20140186593A1

  公开（公告）日：2014-07-03

  Disclosed herein are a resin composition for a printed circuit board, an insulating film, a prepreg, and a printed circuit board, the resin composition including: a composite epoxy resin containing a bisphenol A type epoxy resin, a cresol novolac epoxy resin, a rubber-modified epoxy resin, a phosphorus based epoxy resin, and an alkyl sulfonated tetrazole-modified epoxy resin; and a curing agent. The insulating film and the prepreg according to the present invention may have basically low coefficient of thermal expansion, excellent heat resistance, a high glass transition temperature, and excellent adhesion force with the metal.

  本发明涉及一种用于印刷电路板的树脂组合物、绝缘膜、预浸料和印刷电路板，所述树脂组合物包括：一种复合环氧树脂，其中包含双酚A型环氧树脂、甲酚酚醛环氧树脂、橡胶改性环氧树脂、磷基环氧树脂和烷基磺酸四唑改性环氧树脂；以及一种固化剂。本发明的绝缘膜和预浸料具有基本低的热膨胀系数、优异的耐热性、高玻璃转移温度和与金属的优异粘附力。
• RESIN COMPOSITION, PRINTED CIRCUIT BOARD USING THE COMPOSITION, AND METHOD OF MANUFACTURING THE SAME
  申请人：SAMSUNG ELECTRO-MECHANICS CO., LTD.

  公开号：US20150050473A1

  公开（公告）日：2015-02-19

  A resin composition, a printed circuit board using the composition, and a method of manufacturing the printed circuit board. The resin composition includes: a photopolymerizable compound, such as one having an ethylenically unsaturated bond which is polymerizable in a molecule, a photoinitiator, and a surface-modified silica by an alkyl sulfonated tetrazole compound.

  一种树脂组合物，使用该组合物的印刷电路板，以及制造印刷电路板的方法。该树脂组合物包括：光聚合性化合物，例如具有分子中可聚合的乙烯基不饱和键的化合物，光引发剂，以及通过烷基磺酸四唑化合物进行表面修饰的硅胶。
• Resin composition, printed circuit board using the composition, and method of manufacturing the same
  申请人：SAMSUNG ELECTRO-MECHANICS CO., LTD.

  公开号：US09733565B2

  公开（公告）日：2017-08-15

  A resin composition, a printed circuit board using the composition, and a method of manufacturing the printed circuit board. The resin composition includes: a photopolymerizable compound, such as one having an ethylenically unsaturated bond which is polymerizable in a molecule, a photoinitiator, and a surface-modified silica by an alkyl sulfonated tetrazole compound.

  一种树脂组合物、使用该组合物的印刷电路板以及制造印刷电路板的方法。该树脂组合物包括：光聚合化合物，例如具有分子中可聚合乙烯基不饱和键的化合物；光引发剂；以及由烷基磺酸四唑化合物表面修饰的硅胶。
• 알킬 설폰화된 테트라졸 화합물, 이의 제조방법, 이를 함유하는 에폭시 수지, 및 이로부터 제조된 기판
  申请人：SAMSUNG ELECTRO-MECHANICS CO., LTD. 삼성전기주식회사(119980018064) Corp. No ▼ 130111-0001626BRN ▼124-81-00979

  公开号：KR101540145B1

  公开（公告）日：2015-07-28

  본 발명은 알킬 설폰화된 테트라졸 화합물, 이의 제조방법, 이를 함유하는 에폭시 수지, 및 이로부터 제조된 기판을 제공한다. 상기 에폭시 수지는, 특히, 인쇄회로기판의 재료로 유용하며, 금속과의 접착력이 우수하다.

  这项发明提供了一种含有硫酰化四唑化合物的环氧树脂，以及其制备方法和制备的基板。该环氧树脂特别适用于印刷电路板材料，并具有良好的金属粘附性。