4-[2-(4-Phenoxyphenyl)propan-2-yl]phenol | 127619-35-6

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 4-[2-(4-Phenoxyphenyl)propan-2-yl]phenol
• CAS: 127619-35-6
• 化学式: C₂₁H₂₀O₂
• 分子量: 304.389
• InChiKey: QRPKKQRBXWKLQF-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  5.2
• 重原子数：
  23
• 可旋转键数：
  4
• 环数：
  3.0
• sp3杂化的碳原子比例：
  0.14
• 拓扑面积：
  29.5
• 氢给体数：
  1
• 氢受体数：
  2

反应信息

• 作为产物：
  描述：

  双酚A 、 二苯醚 在 甲烷磺酸 作用下， 以 氯仿 为溶剂， 反应 36.0h， 以80.2%的产率得到4-[2-(4-Phenoxyphenyl)propan-2-yl]phenol
  参考文献：
  名称：

  Transalkylation reactions of 4,4'-(1-methylethylidene)bisphenol with diphenyl ether

  摘要：

  DOI：

  10.1021/jo00303a044

文献信息

• WANG, ZHI YUAN;BERARD, NURIT;WISNIEWSKA, IRENA;HAY, ALLAN S., J. ORG. CHEM., 55,(1990) N6, C. 4966-4969
  作者：WANG, ZHI YUAN、BERARD, NURIT、WISNIEWSKA, IRENA、HAY, ALLAN S.

  DOI：——

  日期：——
• Making a semiconductor device using a highly conductive composition for wafer coating
  申请人：Henkel AG & Co. KGaA

  公开号：EP1944797B1

  公开（公告）日：2014-11-26
• [EN] MALEIMIDE CONTAINING ESTER AND SULFIDE FUNCTIONALITIES<br/>[FR] MALÉIMIDE CONTENANT DES FONCTIONS ESTER ET SULFURE
  申请人：NAT STARCH CHEM INVEST

  公开号：WO2008097225A1

  公开（公告）日：2008-08-14

  [EN] An oligomeric compound that is the Michael addition reaction product of a thiol with a compound having maleimide terminal groups and ester functionality internal in the compound can be formulated into curable compositions to improve adhesion to metal substrates.
  [FR] La présente invention concerne un composé oligomère qui est le produit de réaction d'addition d'un thiol avec un composé comprenant des groupes terminaux maléimides et une fonctionnalité ester interne dans le composé pouvant être formulé en des compositions durcissables pour en améliorer l'adhérence sur des substrats métalliques.
• [EN] THERMALLY REVERSIBLE HOT MELT ADHESIVE COMPOSITION CONTAINING MULTIFUNCTIONAL DIENE AND DIENOPHILE COMPOUNDS<br/>[FR] COMPOSITION D'ADHÉSIF THERMOFUSIBLE THERMIQUEMENT RÉVERSIBLE CONTENANT DES COMPOSÉS DIÈNES ET DIÉNOPHILES MULTIFONCTIONNELS
  申请人：HENKEL CORP

  公开号：WO2010144774A2

  公开（公告）日：2010-12-16

  The invention relates to a thermally reversible hot melt adhesive that is isocyanate-free, moisture independent, crosslinkable and thermally reversible. The thermally reversible hot melt adhesive may be repeatedly heated and cooled without negatively affecting the performance of the adhesive. The thermally reversible composition may also be used as a primer layer. The thermally reversible hot melt adhesive and primer are particularly well suited for end use applications such as packaging, graphic arts, construction, footwear, textiles, general assembly, automotive and consumer goods.
• [EN] EPOXY MOLDING COMPOUND USING ANHYDRIDE HARDENER, MANUFACTURING PROCESS AND USE THEREOF<br/>[FR] COMPOSÉ DE MOULAGE ÉPOXY UTILISANT UN DURCISSEUR ANHYDRIDE, SON PROCÉDÉ DE FABRICATION ET SON UTILISATION
  申请人：ABLESTIK (SHANGHAI) LTD

  公开号：WO2016145647A1

  公开（公告）日：2016-09-22

  Provided is an epoxy molding compound comprising (a) an epoxy resin; (b) an anhydride hardener with specific structures; (c) a curing accelerator; (d) a filler; and optionally (e) one or more additives. By using anhydrides with specific structures as hardeners for epoxy resins, the molded products produced from the epoxy molding compounds can have Tg higher than 250℃, which can stand high working temperature, and thus can be used in high temperature applications, especially in high power electrical or electronic devices.