2,2'-dimethyl-4,4'-bis(4-aminophenoxy)biphenyl | 202003-31-4

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 2,2'-dimethyl-4,4'-bis(4-aminophenoxy)biphenyl
• 英文别名: 4,4'-bis(4-aminophenoxy)-2,-2'-dimethylbiphenyl；4,4'-bis(4-aminophenoxy)-2,2'-dimethylbiphenyl；4-[4-[4-(4-aminophenoxy)-2-methylphenyl]-3-methylphenoxy]aniline
• CAS: 202003-31-4
• 化学式: C₂₆H₂₄N₂O₂
• 分子量: 396.489
• InChiKey: SUYRSWAKTQOISJ-UHFFFAOYSA-N

物化性质

• 沸点：
  556.6±50.0 °C(Predicted)
• 密度：
  1.190±0.06 g/cm3(Predicted)

计算性质

• 辛醇/水分配系数(LogP)：
  6
• 重原子数：
  30
• 可旋转键数：
  5
• 环数：
  4.0
• sp3杂化的碳原子比例：
  0.08
• 拓扑面积：
  70.5
• 氢给体数：
  2
• 氢受体数：
  4

反应信息

• 作为产物：
  描述：

  4,4'-bis(4-nitrophenoxy)-2,2'-dimethylbiphenyl 、 甲烷 在 Pt/C 作用下， 以 水 、 N,N-二甲基甲酰胺 为溶剂， 以59.2 g (85%)的产率得到2,2'-dimethyl-4,4'-bis(4-aminophenoxy)biphenyl
  参考文献：
  名称：

  US6037499

  摘要：

  公开号：

文献信息

• Aromatic diamines and polyimides based on 4,4'-bis-(4-aminophenoxy)-2,2'
  申请人：The United States of America as represented by the Administrator of the

  公开号：US06069278A1

  公开（公告）日：2000-05-30

  This invention relates the novel diamines, the polyimide oligomers and the polyimides derived therefrom and to the method of preparing the diamines, oligomers and the polyimides. The thermoplastic polyimides derived from the aromatic diamines of this invention are characterized as having a high glass transition temperature, good mechanical properties and improved processability in the manufacture of adhesives, electronic and composite materials for use in the automotive and aerospace industry. The distinction of the novel aromatic diamines of this invention is the 2,2',6,6'-substituted biphenyl radicals which exhibit noncoplanar conformation that enhances the solubility of the diamine as well as the processability of the polyimides, while retaining a relatively high glass transition temperature and improved mechanical properties at useful temperature ranges.

  本发明涉及新型二胺、聚酰亚胺低聚体及其衍生的聚酰亚胺，以及制备二胺、低聚体和聚酰亚胺的方法。本发明的芳香族二胺制备的热塑性聚酰亚胺具有高玻璃化转变温度、良好的机械性能和改进的可加工性，可用于制造粘合剂、电子和复合材料，应用于汽车和航空航天工业。本发明的新型芳香族二胺的特点是2,2'，6,6'-取代联苯基团，表现出非共面构象，增强了二胺的溶解性以及聚酰亚胺的可加工性，同时在有用的温度范围内保持相对较高的玻璃化转变温度和改进的机械性能。
• Polyimides based on 4,4'-bis (4-aminophenoxy)-2,2'or 2,2',
  申请人：The United States of America as represented by the Administrator of the

  公开号：US05939521A1

  公开（公告）日：1999-08-17

  This invention relates the novel diamines, the polyimide oligomers and the polyimides derived therefrom and to the method of preparing the diamines, oligomers and the polyimides. The thermoplastic polyimides derived from the aromatic diamines of this invention are characterized as having a high glass transition temperature, good mechanical properties and improved processability in the manufacture of adhesives, electronic and composite materials for use in the automotive and aerospace industry. The distinction of the novel aromatic diamines of this invention is the 2,2',6,6'-substituted biphenyl radicals which exhibit noncoplanar conformation that enhances the solubility of the diamine as well as the processability of the polyimides, while retaining a realatively high glass transition temperature and improved mechanical properties at useful temperature ranges.

  本发明涉及新颖的二胺、聚酰亚胺低聚体和由此制备的聚酰亚胺，以及制备二胺、低聚体和聚酰亚胺的方法。本发明的芳香族二胺衍生的热塑性聚酰亚胺具有高玻璃化转变温度、良好的机械性能和改善的加工性能，可用于汽车和航空航天工业中的粘合剂、电子和复合材料的制造。本发明的新颖芳香族二胺的特点是2,2',6,6'-取代的联苯基团，这些基团呈非共面构象，增强了二胺的溶解性和聚酰亚胺的加工性能，同时保持了相对较高的玻璃化转变温度和改善的机械性能在有用的温度范围内。
• Precursor for polyimide and use thereof
  申请人：ETERNAL MATERIALS CO., LTD.

  公开号：US10626220B2

  公开（公告）日：2020-04-21

  The present invention provides an amic acid ester oligomer having a structure of Formula (1) or (1′): wherein G, P, R, Rx, D, E and m are as defined in the specification. The present invention also provides a polyimide precursor composition comprising the amic acid ester oligomer, as well as a polyimide prepared from the composition.

  本发明提供了一种具有式（1）或（1′）结构的胺基酸酯低聚物： 其中 G、P、R、Rx、D、E 和 m 如说明书中所定义。本发明还提供了一种聚酰亚胺前体组合物，该组合物中包含该胺基酸酯低聚物，以及由该组合物制备的聚酰亚胺。
• Polyimide precursor composition and use thereof
  申请人：ETERNAL MATERIALS CO., LTD.

  公开号：US10731004B2

  公开（公告）日：2020-08-04

  The present invention provides a polyimide precursor composition comprising an amic acid ester oligomer of Formula (1): and a diamine of Formula (2) or (3): wherein G, P, R, Rx, P′, D, E and m are as defined herein. The present invention also provides a dry film containing the polyimide precursor composition, as well as a polyimide film and polyimide laminate prepared from the composition.

  本发明提供了一种聚酰亚胺前体组合物，其中包含式（1）的胺基酸酯低聚物： 和 式 (2) 或 (3) 的二胺： 其中 G、P、R、Rx、P′、D、E 和 m 如本文所定义。 本发明还提供了一种含有聚酰亚胺前体组合物的干膜，以及由该组合物制备的聚酰亚胺薄膜和聚酰亚胺层压板。
• Metal clad laminate, preparation method thereof, and method for preparing flexible circuit board by using the same
  申请人：ETERNAL MATERIALS CO., LTD.

  公开号：US10765008B2

  公开（公告）日：2020-09-01

  The present disclosure provides a metal clad laminate, a preparation method thereof, and a method for preparing a flexible circuit board by using the same. The metal clad laminate of the present disclosure includes a first metal foil, a first polyimide layer directly disposed on the first metal foil, a second metal foil, and a second polyimide layer directly disposed on the second metal foil, the first polyimide layer being in contact with the second polyimide layer. The metal clad laminate of the present disclosure is equivalent to a double-sided flexible copper clad laminate (FCCL) in structure, is superior to a single-sided FCCL in terms of mechanical performance in reducing warpage, and has the advantage of being useful for circuit fabrication simultaneously on both sides thereof.

  本公开提供了一种金属包覆层压板、其制备方法以及使用其制备柔性电路板的方法。本公开的金属包覆层压板包括第一金属箔、直接设置在第一金属箔上的第一聚酰亚胺层、第二金属箔和直接设置在第二金属箔上的第二聚酰亚胺层，第一聚酰亚胺层与第二聚酰亚胺层接触。本公开的金属覆铜箔层压板在结构上等同于双面柔性覆铜箔层压板（FCCL），在减少翘曲的机械性能方面优于单面 FCCL，并且具有可在其两面同时用于电路制造的优点。