Hydroxylation of C-alkylated phenols has been achieved by employing cerium (IV) ammonium nitrate and hydrogen peroxide in acetic acid medium. The yield of hydroxylation products increases markedly when 3 × 10-3 M solution of sodium dodecyl sulphate is added to the oxidation system. The plausible mechanism of the reaction seems to involve free radical intermediates and is influenced by hydrophobic environment
Hydroxylation of alkylphenols has been achieved by oxidation with cerium(IV) ammonium nitrate in conjunction with hydrogenperoxide in sodiumdodecylsulphate medium; concurrent oxidation of alkyl groups and subsequent decarboxylation have also been observed in some cases.
CHAWLA, H. MOHINDRA;SHARMA, S. KUMAR;CHAKRABARTY, K.;BHANUMATI, S., J. CHEM. SOC. CHEM. COMMUN.,(1988) N 2, 128-129
作者:CHAWLA, H. MOHINDRA、SHARMA, S. KUMAR、CHAKRABARTY, K.、BHANUMATI, S.
DOI:——
日期:——
CHAWLA, H. MOHINDRA;SHARMA, S. CHAKRABARTY SHAKRABARTY K.;BHANUMATI, S., TETRAHEDRON, 44,(1988) N 4, 1227-1234
作者:CHAWLA, H. MOHINDRA、SHARMA, S. CHAKRABARTY SHAKRABARTY K.、BHANUMATI, S.
DOI:——
日期:——
PHOSPHORUS-CONTAINING POLYPHENYLENE OXIDE RESIN, ITS PREPARATION METHOD, METHOD FOR PREPARING PREPOLYMER OF PHOSPHORUS-CONTAINING POLYPHENYLENE OXIDE, RESIN COMPOSITION AND ITS APPLICATION
申请人:Elite Material Co., Ltd.
公开号:US20170088669A1
公开(公告)日:2017-03-30
The present invention relates to a phosphorus-containing polyphenylene oxide resin, its preparation method, a method for preparing the prepolymer of the phosphorus-containing polyphenylene oxide, a resin composition and an article thereof, wherein the phosphorus-containing polyphenylene oxide resin has a chemical structure represented by the following formula (I):
wherein R′ is
R″ is
R′″ is hydrogen,
Through the use of the above phosphorus-containing polyphenylene oxide resin, an article made from the resin composition can has good flame retardance, good thermal resistance and a lower percent of thermal expansion while dielectric properties can be maintained, such that the present invention is suitable for use in products such as copper clad laminate and printed circuit board.