A Green Recyclable Poly(4-Vinylpyridine)-Supported Copper Iodide Nanoparticle Catalyst for the Chemoselective Synthesis of Pentaerythritol Diacetals from Aromatic Aldehydes
Poly(4-vinylpyridine)-supported copper(I) iodide nanoparticles have been used as an efficient, green recyclable catalyst for the chemoselective synthesis of pentaerythritol diacetals from aromatic aldehydes and pentaerythritol under solvent-free conditions. This catalyst was reused six times without any loss of its activity.
Montmorillonite Clays Catalysis. Part 12.1 An Efficient and Practical Procedure for Synthesis of Diacetals from 2,2-Bis(hydroxymethyl)propane-1,3-diol with Carbonyl Compounds
作者:Zhan-Hui Zhang,、Tong-Shuang Li、Tong-Shou Jin、Ji-Tai Li
DOI:10.1039/a803046d
日期:——
Preparation of diacetals from 2,2-bis(hydroxymethyl)propane-1,3-diol with aldehydes and ketones is catalysed by montmorillonite clays in refluxing benzene or toluene in good to excellent yield.
A Practical and Efficient Procedure for Preparation of Diacetals from 2,2-Bis(hydroxymethyl)propane-1,3-diol with Aldehydes and Ketones Catalysed by Anhydrous Ferrous Sulfate
作者:Tong-Shou Jin、Yan-Ran Ma、Tong-Shuang Li、Jian-Xin Wang
DOI:10.1039/a900025i
日期:——
Synthesis of diacetals in excellent yields from aldehydes and ketones with 2,2-bis(hydroxymethyl)propane-1,3-diol is carried out in refluxing benzene or toluene with anhydrous ferrous sulfate as catalyst.
Process for producing allylsubstituted phenol compound and the product
申请人:MITSUBISHI PETROCHEMICAL CO., LTD.
公开号:EP0394949A2
公开(公告)日:1990-10-31
A process for producing an allyl-substituted phenol compound is described, which comprises a combination of a first step in which a phenol is reacted with an allyl halide in the presence of an alkaline aqueous medium to allyl-etherify the phenol and a second step in which the reaction product obtained in the first step and containing the allyl-etherified phenol is subjected to a Claisen rearrangement reaction in the absence of a medium. Also, a compound obtained by the above process is described.
Flexible metal laminate and heat-resistant adhesive composition
申请人:Koyano Ichirou
公开号:US20050175850A1
公开(公告)日:2005-08-11
An object of the present invention is to provide a flexible metallic layered product preferably used for a flexible printed board for flip chip bonding, which is required to have high heat resistance and pressure resistance by improving heat resistance of the flexible metallic layered product, in particular, improving heat resistance of the layer contacting the metallic layer, and a heat resistant adhesive composition. In order to achieve the object, the present invention provides a flexible metallic layered product comprising at least a three-dimensional cross-linking type thermosetting resin layer and a thermoplastic resin layer are layered on a metallic layer in this order. In particular, when a ratio (t1/t2) between the thickness (t1) of the three-dimensional cross-linking type thermosetting resin layer and the thickness (t2) of the total resin layers, which are layered on the metallic layer, is in a range from 7/100 to 85/100, heat resistance of the total resin layers, which are layered on the metallic layer, is more improved.