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3,9-bis(2-hydroxyphenyl)-2,4,8,10-tetraoxaspiro[5.5]undecane | 23285-18-9

中文名称
——
中文别名
——
英文名称
3,9-bis(2-hydroxyphenyl)-2,4,8,10-tetraoxaspiro[5.5]undecane
英文别名
2-[9-(2-Hydroxyphenyl)-2,4,8,10-tetraoxaspiro[5.5]undecan-3-yl]phenol;2-[3-(2-hydroxyphenyl)-2,4,8,10-tetraoxaspiro[5.5]undecan-9-yl]phenol
3,9-bis(2-hydroxyphenyl)-2,4,8,10-tetraoxaspiro[5.5]undecane化学式
CAS
23285-18-9
化学式
C19H20O6
mdl
MFCD00382276
分子量
344.364
InChiKey
QLEMXKCIAQLFMM-UHFFFAOYSA-N
BEILSTEIN
——
EINECS
——
  • 物化性质
  • 计算性质
  • ADMET
  • 安全信息
  • SDS
  • 制备方法与用途
  • 上下游信息
  • 反应信息
  • 文献信息
  • 表征谱图
  • 同类化合物
  • 相关功能分类
  • 相关结构分类

物化性质

  • 沸点:
    458.2±40.0 °C(Predicted)
  • 密度:
    1.39±0.1 g/cm3(Predicted)

计算性质

  • 辛醇/水分配系数(LogP):
    1.8
  • 重原子数:
    25
  • 可旋转键数:
    2
  • 环数:
    4.0
  • sp3杂化的碳原子比例:
    0.37
  • 拓扑面积:
    77.4
  • 氢给体数:
    2
  • 氢受体数:
    6

反应信息

  • 作为产物:
    描述:
    季戊四醇邻甲基苄醇硫酸酯zirconium(IV) oxide 作用下, 以 甲苯 为溶剂, 反应 1.5h, 以99%的产率得到3,9-bis(2-hydroxyphenyl)-2,4,8,10-tetraoxaspiro[5.5]undecane
    参考文献:
    名称:
    xxx, Indian Journal of Chemistry - Section B Organic and Medicinal Chemistry, 2000, vol. 39, # 11, p. 858 - 859
    摘要:
    DOI:
点击查看最新优质反应信息

文献信息

  • A Green Recyclable Poly(4-Vinylpyridine)-Supported Copper Iodide Nanoparticle Catalyst for the Chemoselective Synthesis of Pentaerythritol Diacetals from Aromatic Aldehydes
    作者:Jalal Albadi、Nasir Iravani、Farhad Shirini、Farzaneh Dehghan
    DOI:10.3184/174751912x13460806564901
    日期:2012.10
    Poly(4-vinylpyridine)-supported copper(I) iodide nanoparticles have been used as an efficient, green recyclable catalyst for the chemoselective synthesis of pentaerythritol diacetals from aromatic aldehydes and pentaerythritol under solvent-free conditions. This catalyst was reused six times without any loss of its activity.
    聚(4-乙烯基吡啶)负载的碘化铜(I)纳米粒子已被用作一种高效的绿色可回收催化剂,用于在无溶剂条件下从芳香醛和季戊四醇化学选择性合成季戊四醇二缩醛。该催化剂可重复使用六次,其活性没有任何损失。
  • Montmorillonite Clays Catalysis. Part 12.1 An Efficient and Practical Procedure for Synthesis of Diacetals from 2,2-Bis(hydroxymethyl)propane-1,3-diol with Carbonyl Compounds
    作者:Zhan-Hui Zhang,、Tong-Shuang Li、Tong-Shou Jin、Ji-Tai Li
    DOI:10.1039/a803046d
    日期:——
    Preparation of diacetals from 2,2-bis(hydroxymethyl)propane-1,3-diol with aldehydes and ketones is catalysed by montmorillonite clays in refluxing benzene or toluene in good to excellent yield.
    用 aldehydes 和 ketones 制备 2,2-bis(hydroxymethyl)propane-1,3-diol 的二缩醛,在回流的苯或甲苯中以蒙脱石粘土作为催化剂,产率良好至优秀。
  • A Practical and Efficient Procedure for Preparation of Diacetals from 2,2-Bis(hydroxymethyl)propane-1,3-diol with Aldehydes and Ketones Catalysed by Anhydrous Ferrous Sulfate
    作者:Tong-Shou Jin、Yan-Ran Ma、Tong-Shuang Li、Jian-Xin Wang
    DOI:10.1039/a900025i
    日期:——
    Synthesis of diacetals in excellent yields from aldehydes and ketones with 2,2-bis(hydroxymethyl)propane-1,3-diol is carried out in refluxing benzene or toluene with anhydrous ferrous sulfate as catalyst.
    在回流的苯或甲苯中,以无水硫酸亚铁为催化剂,由醛和酮与 2,2-双(羟甲基)丙烷-1,3-二醇以优异的收率合成二缩醛。
  • Process for producing allylsubstituted phenol compound and the product
    申请人:MITSUBISHI PETROCHEMICAL CO., LTD.
    公开号:EP0394949A2
    公开(公告)日:1990-10-31
    A process for producing an allyl-substituted phenol compound is described, which comprises a combi­nation of a first step in which a phenol is reacted with an allyl halide in the presence of an alkaline aqueous medium to allyl-etherify the phenol and a second step in which the reaction product obtained in the first step and containing the allyl-etherified phenol is subjected to a Claisen rearrangement reaction in the absence of a medium. Also, a compound obtained by the above process is described.
    本发明描述了一种生产烯丙基取代的苯酚化合物的工艺,该工艺包括两个步骤:第一步,在碱性水介质存在下,苯酚与烯丙基卤化物反应,使苯酚烯丙基醚化;第二步,在没有介质存在的情况下,对第一步得到的含有烯丙基醚化苯酚的反应产物进行克莱森重排反应。此外,还描述了通过上述工艺获得的一种化合物。
  • Flexible metal laminate and heat-resistant adhesive composition
    申请人:Koyano Ichirou
    公开号:US20050175850A1
    公开(公告)日:2005-08-11
    An object of the present invention is to provide a flexible metallic layered product preferably used for a flexible printed board for flip chip bonding, which is required to have high heat resistance and pressure resistance by improving heat resistance of the flexible metallic layered product, in particular, improving heat resistance of the layer contacting the metallic layer, and a heat resistant adhesive composition. In order to achieve the object, the present invention provides a flexible metallic layered product comprising at least a three-dimensional cross-linking type thermosetting resin layer and a thermoplastic resin layer are layered on a metallic layer in this order. In particular, when a ratio (t1/t2) between the thickness (t1) of the three-dimensional cross-linking type thermosetting resin layer and the thickness (t2) of the total resin layers, which are layered on the metallic layer, is in a range from 7/100 to 85/100, heat resistance of the total resin layers, which are layered on the metallic layer, is more improved.
    本发明的目的是提供一种柔性金属分层产品,优选用于倒装芯片粘接的柔性印刷电路板,通过提高柔性金属分层产品的耐热性,特别是提高与金属层接触层的耐热性,以及耐热粘合剂组合物,要求该产品具有较高的耐热性和耐压性。为了实现上述目的,本发明提供了一种柔性金属分层产品,该产品至少由三维交联型热固性树脂层和热塑性树脂层按此顺序分层在金属层上。特别是,当三维交联型热固性树脂层的厚度(t1)与层叠在金属层上的总树脂层的厚度(t2)之比(t1/t2)在 7/100 至 85/100 之间时,层叠在金属层上的总树脂层的耐热性能得到更好的改善。
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