An object of the present invention is to provide a flexible metallic layered product preferably used for a flexible printed board for flip chip bonding, which is required to have high heat resistance and pressure resistance by improving heat resistance of the flexible metallic layered product, in particular, improving heat resistance of the layer contacting the metallic layer, and a heat resistant adhesive composition. In order to achieve the object, the present invention provides a flexible metallic layered product comprising at least a three-dimensional cross-linking type thermosetting resin layer and a thermoplastic resin layer are layered on a metallic layer in this order. In particular, when a ratio (t1/t2) between the thickness (t1) of the three-dimensional cross-linking type thermosetting resin layer and the thickness (t2) of the total resin layers, which are layered on the metallic layer, is in a range from 7/100 to 85/100, heat resistance of the total resin layers, which are layered on the metallic layer, is more improved.
本发明的目的是提供一种柔性
金属分层产品,优选用于倒装芯片粘接的柔性印刷电路板,通过提高柔性
金属分层产品的耐热性,特别是提高与
金属层接触层的耐热性,以及耐热粘合剂组合物,要求该产品具有较高的耐热性和耐压性。为了实现上述目的,本发明提供了一种柔性
金属分层产品,该产品至少由三维交联型热固性
树脂层和热塑性
树脂层按此顺序分层在
金属层上。特别是,当三维交联型热固性
树脂层的厚度(t1)与层叠在
金属层上的总
树脂层的厚度(t2)之比(t1/t2)在 7/100 至 85/100 之间时,层叠在
金属层上的总
树脂层的耐热性能得到更好的改善。