The present application is directed to immunomodulatory compositions comprising invariant NKT cell (iNKT cell) agonist compounds that induce expansion of tissue resident memory T-cells (Trm Cells) in combination with an immune stimulator agent that enhances an immune response to a target antigen or a polynucleotide encoding the immune stimulator. The iNKT agonists are a-GalCer analogue compounds modified at the 6 position of the galactose ring. The immune stimulator is an antigen or an mRNA encoding an antigen to create a vaccine formulation. These combinations are used in the treatment of infection or cancer in a subject, or to enrich the number of Trm cells in the liver of a subject.
COMPOSITION FOR WATER-REPELLENT TREATMENT OF SURFACE, AND METHOD FOR WATER-REPELLENT TREATMENT OF SURFACE OF SEMICONDUCTOR SUBSTRATE USING SAME
申请人:Wako Pure Chemical Industries, Ltd.
公开号:EP2615633A1
公开(公告)日:2013-07-17
The purpose of the present invention to provide: a composition which can be used for water-repellent treating of the entire surface of a semiconductor substrate having a pattern formed by laminating a Si-containing insulating layer and a metal layer, at one time; and a method for water-repellent treatment of the semiconductor substrate surface using the composition.
The present invention relates to: (1) a composition for water-repellent treatment of a semiconductor substrate surface comprising a) at least one kind of a compound selected from the group consisting of a long-chain alkyl tertiary amine and a long-chain alkyl ammonium salt, b) a base or an acid generating agent, having a condensed ring structure or forming a condensed ring structure by generating a base or an acid and c) a polar organic solvent, and (2) a method for water-repellent treatment of the semiconductor substrate surface having the pattern formed by laminating the Si-containing insulating layer and the metal layer, using the composition.
本发明的目的是:提供一种组合物,该组合物可用于一次性对具有通过层叠含硅绝缘层和金属层而形成的图案的半导体衬底的整个表面进行憎水处理;以及一种使用该组合物对半导体衬底表面进行憎水处理的方法。
本发明涉及(1) 一种用于对半导体衬底表面进行憎水处理的组合物,该组合物包含 a) 至少一种选自由长链烷基叔胺和长链烷基铵盐组成的组的化合物;b) 碱或酸生成剂、(2) 使用该组合物对具有通过层压含硅绝缘层和金属层而形成的图案的半导体衬底表面进行憎水处理的方法。
NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, CURED FILM, INSULATING FILM, COLOR FILTER, AND DISPLAY DEVICE
申请人:Tokyo Ohka Kogyo Co., Ltd.
公开号:EP2725423A1
公开(公告)日:2014-04-30
Provided are: a negative-type photosensitive resin composition capable of forming a pattern having favorable adhesiveness at a low light exposure; a pattern forming method using the negative-type photosensitive resin composition; a cured film, an insulating film, and a color filter formed using the negative-type photosensitive resin composition; and a display device provided with the cured film, insulating film, or color filter. The negative-type photosensitive resin composition according to the present invention contains a compound represented by the following formula (1). In the formula, R1 and R2 each independently indicate a hydrogen atom or an organic group, but at least one indicates an organic group. R1 and R2 may be bonded to form a ring structure and may contain a hetero atom bond. R3 indicates a single bond or an organic group. R4 to R9 each independently indicate a hydrogen atom, an organic group, etc., but R6 and R7 are never hydroxyl groups. R10 indicates a hydrogen atom or an organic group.
Provided is a novel compound suitable for obtaining a negative-type photosensitive resin composition capable of forming a pattern having favorable adhesiveness at a low light exposure. The compound according to the present invention is represented by the following formula (1). In the formula, R1 and R2 each independently indicate a hydrogen atom or an organic group, but at least one indicates an organic group. R1 and R2 may be bonded to form a ring structure and may contain a hetero atom bond. R3 indicates a single bond or an organic group. R4 to R9 each independently indicate a hydrogen atom, an organic group, etc., but R6 and R7 are never hydroxyl groups. R10 indicates a hydrogen atom or an organic group.
There is provided an epoxy resin composition containing an epoxy compound, which has a low viscosity and a low dielectric constant, and when added to a general-purpose epoxy resin composition, can lower a viscosity of the composition and can sufficiently lower a dielectric constant of an epoxy resin cured product obtained from the composition. An epoxy resin composition comprising: (a) an epoxy component containing at least an epoxy compound of formula [1]; and (b) a curing agent:
wherein R1 to R3 each independently are a hydrogen atom or methyl group, and L1 to L3 each independently are pentamethylene group, hexamethylene group or heptamethylene group.
Curable composition including siloxane oligomer and inorganic fine particles
申请人:NISSAN CHEMICAL INDUSTRIES, LTD.
公开号:US10125267B2
公开(公告)日:2018-11-13
A material having a low refractive index that exhibits sufficiently low refractive index without deteriorating the strength of cured film produced therefrom, that can be cured by an active energy ray that is applicable for a resin base material that is not desired to be exposed to heat. Curable composition including: siloxane oligomer (a) containing a radically polymerizable double bond obtained through hydrolysis and condensation of alkoxysilanes containing at least an alkoxysilane A of Formula [1] and alkoxysilane B of Formula [2] in an amount of 100 parts by mass; inorganic fine particles (b) in amount of 10 parts by mass to 1,000 parts by mass; polymerization initiator (c) generating a radical upon active energy ray irradiation in an amount of 0.1 parts by mass to 25 parts by mass
R1aSi(OR2)4-a [1]
R3bSi(OR4)4-b [2]
a cured film produced from the composition, and a laminate including a low refractive index layer produced from the composition.