Direct oxidative installation of nitrooxy group at benzylic positions and its transformation into various functionalities
摘要:
C-H Nitrooxylation at benzylic positions has been achieved by employing the N-hydroxyphthalimide (NHPI) catalyst/cerium(IV) ammonium nitrate (CAN) reagent system. The nitrooxy groups were demonstrated to function as tentative hydroxy protecting groups, as well as excellent leaving groups for N- and C-substitution reactions. Hence, the present method offers a unique way to synthesize diverse O-. N-, or C-functionalized benzylic compounds from simple alkyl aromatics. (C) 2011 Elsevier Ltd. All rights reserved.
Oxidation of Benzylic Alcohols and Ethers to Carbonyl Derivatives by Nitric Acid in Dichloromethane
作者:Paolo Strazzolini、Antonio Runcio
DOI:10.1002/ejoc.200390090
日期:2003.2
Nitricacid in dichloromethane may be successfully employed for the oxidation of benzylic alcohols and ethers to the corresponding carbonyl compounds. The proposed method proved to be of general applicability, affording very good yields of aldehydes and ketones and showing interesting chemoselectivity in many instances, allowing competitive aromatic nitration to be avoided, as well as − in the case
New One-Pot Synthesis of Alkyl Nitrates from Alcohols
作者:Luis Castedo、Carlos F. Marcos、Mercedes Monteagudo、Gabriel Tojo
DOI:10.1080/00397919208019268
日期:1992.3
Abstract Treatment of alcohols with Ph3P-I2-invidazole followed by “in situ” reaction of the generated iodides with AgNO3 allows the mild conversion of alcohols into alkyl nitrates. Unlike previous procedures, this one requires no electrophilic nitrating conditions.
wide variety of alkyl halides with mercury(I) and/or (II) nitrate in 1,2-dimethoxyethane, mercury(II) acetate in acetic acid, aqueous mercury(II) perchlorate, and mercury(II) perchlorate in alcohol solvents have been investigated; as a result, simple high yield procedures for the conversion of alkyl halides into the corresponding nitrate esters, acetate esters, alcohols and ethers have been developed.
Photosensitive resin composition and photosensitive films and laminates made by using the same
申请人:——
公开号:US20040265731A1
公开(公告)日:2004-12-30
A photosensitive resin composition of the present invention contains a (A) soluble polyimide and a (b) (meth)acrylic compound, the (A) soluble polyimide being soluble in an organic solvent and being synthesized by using an acid dianhydride component and at least one of a diamine component containing a siloxane structure or an aromatic ring structure, and a diamine component having, in its structure, a hydroxyl group a carboxyl group or a carbonyl group, and the (B) (meth)acrylic compound having at least one carbon-carbon double bond, and preferably contains at least one of a (C) photo reaction initiator and a (D) fire retardant. With this arrangement, the photosensitive resin composition of the present invention is capable of having excellent properties. Especially, the photosensitive resin composition of the present invention is so excellently useful that it can be used for electronic parts and the like.
Photosensitive resin composition capable of being developed with aqueous developer and photosensitive dry film resist, and use thereof
申请人:Okada Koji
公开号:US20060199920A1
公开(公告)日:2006-09-07
A photosensitive resin composition according to the present invention includes at least a base resin component (A) and a (meth)acryls compound (B), wherein the base resin component (A) is any one of: a polyimide resin (A-1) having at least either a hydroxyl group or a carboxyl group in its structure; a polyamide resin (A-2) having at least either a hydroxyl group or a carboxyl group in its structure; and photosensitive imide(meth)acrylsiloxaneoligomer (A-3). On this account, it is possible to realize characteristics such as (1) realization and improvement of water system developing property, (2) improvement of utility as an imidized film, (3) improvement of post-curing property, and (4) simplification of manufacture of a print wiring substrate. Thus, the photosensitive resin composition can be favorably used particularly in a photosensitive dry film resin, a laminate using the same, a print wiring substrate using the same, and the like.