申请人:Shin-Etsu Chemical Co., Ltd.
公开号:US20180051199A1
公开(公告)日:2018-02-22
A heat-conductive silicone resin composition is provided comprising (A) an alkenyl-containing organopolysiloxane, (B) a SiH-containing organohydrogenpolysiloxane, (C) a heat-conductive filler, (D) a platinum group metal based catalyst, and (E) a thiol or sulfide group-containing organic compound. The composition has a cure onset time at 150° C. of from 10 minutes to less than 30 minutes, as measured by a scanning vibrating needle curemeter. The invention is effective for substantially suppressing unintended thickening or curing during the semiconductor device fabrication process even at a temperature of 150° C. or higher, but the composition is still curable in the desired shape.