申请人:Kyoeisha Chemical Co., Ltd.
公开号:EP2565234A1
公开(公告)日:2013-03-06
Disclosed is a wax that is added to a thermoplastic resin that undergoes a molding process at high temperatures. The wax does not thermally decompose when that thermoplastic resin composition undergoes the molding process. The wax also prevents mold fouling and provides superior lubricating properties and mold release properties. Also disclosed are a method for producing the wax with superior productivity, a lubricant and mold release agent for thermoplastic resin molding processes.
The wax contains a dehydration condensed amide wax component. 99.98-5% by weight of which is an acid, which is formed from 2 mol of a C12-22 saturated aliphatic monocarboxylic acid by molar ratio and "a" mole of a C2-12 polybasic acid by molar ratio (0≤"a"≤5), and "b" mole of a C2-14 diamine by molar ratio (1≤"b"≤6), and 0.02-5% by weight of an oxidation inhibitor that has compatibility with this amide wax component.
本发明公开了一种蜡,可添加到在高温下进行成型加工的热塑性树脂中。该蜡在热塑性树脂组合物经过模塑过程时不会发生热分解。蜡还能防止模具堵塞,并提供优异的润滑性能和脱模性能。此外,还公开了一种生产蜡的方法,这种蜡具有优异的生产率,是热塑性树脂成型工艺的润滑剂和脱模剂。
该蜡含有脱水缩合酰胺蜡成分。其中 99.98-5%(重量)是一种酸,由 2 摩尔摩尔比的 C12-22 饱和脂肪族一羧酸和 "a "摩尔比的 C2-12 多基酸(0≤"a"≤5)以及 "b "摩尔比的 C2-14 二胺(1≤"b"≤6)形成,以及 0.02-5%(重量)与该酰胺蜡组分相容的氧化抑制剂。