Method for manufacturing structure having recessed pattern, resin composition, method for forming electroconductive film, electronic circuit, and electronic device
申请人:JSR CORPORATION
公开号:US10392699B2
公开(公告)日:2019-08-27
The present invention relates to: a method of producing a structure having a recessed pattern; a resin composition; a method of forming an electroconductive film; an electronic circuit; and an electronic device. The method of producing a structure having a recessed pattern includes the following steps (i) and (ii), and the recessed pattern has a film thickness that is thinner by 5% to less than 90% with respect to that of a coating film obtained in the step (i):
(i) the step of forming a coating film on a non-flat surface of a structure using a resin composition which includes an acid-dissociable group-containing polymer and an acid generator; and
(ii) the step of forming a recess by subjecting a prescribed part of a portion of the coating film to irradiation with radiation.
本发明涉及:一种生产具有凹陷图案的结构的方法;一种树脂组合物;一种形成导电薄膜的方法;一种电子电路;以及一种电子设备。生产具有凹陷图案的结构的方法包括以下步骤(i)和(ii),凹陷图案的薄膜厚度比步骤(i)中获得的涂膜薄 5%至小于 90%:
(i) 使用树脂组合物在结构的非平面上形成涂膜的步骤,该树脂组合物包括含酸可分解基团的聚合物和酸生成物;以及
(ii) 通过对涂膜部分的规定部分进行辐射形成凹槽的步骤。