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4-[2-[4-Hydroxy-3,5-bis[(4-hydroxyphenyl)methyl]phenyl]propan-2-yl]-2,6-bis[(4-hydroxyphenyl)methyl]phenol | 107375-96-2

中文名称
——
中文别名
——
英文名称
4-[2-[4-Hydroxy-3,5-bis[(4-hydroxyphenyl)methyl]phenyl]propan-2-yl]-2,6-bis[(4-hydroxyphenyl)methyl]phenol
英文别名
——
4-[2-[4-Hydroxy-3,5-bis[(4-hydroxyphenyl)methyl]phenyl]propan-2-yl]-2,6-bis[(4-hydroxyphenyl)methyl]phenol化学式
CAS
107375-96-2
化学式
C43H40O6
mdl
——
分子量
652.8
InChiKey
GAQVMXQTDHIDGW-UHFFFAOYSA-N
BEILSTEIN
——
EINECS
——
  • 物化性质
  • 计算性质
  • ADMET
  • 安全信息
  • SDS
  • 制备方法与用途
  • 上下游信息
  • 反应信息
  • 文献信息
  • 表征谱图
  • 同类化合物
  • 相关功能分类
  • 相关结构分类

计算性质

  • 辛醇/水分配系数(LogP):
    10.3
  • 重原子数:
    49
  • 可旋转键数:
    10
  • 环数:
    6.0
  • sp3杂化的碳原子比例:
    0.16
  • 拓扑面积:
    121
  • 氢给体数:
    6
  • 氢受体数:
    6

文献信息

  • Optically active compound and photosensitive resin composition
    申请人:——
    公开号:US20030211421A1
    公开(公告)日:2003-11-13
    A photoactive compound is used in combination with a photosensitizer, represented by the following formula (1): A −[( J ) m −( X-Pro )] n (1) wherein A represents a hydrophobic unit comprising at least one kind of hydrophobic groups selected from a hydrocarbon group and a heterocyclic group, J represents a connecting group, X-Pro represents a hydrophilic group protected by a protective group Pro which is removable by light exposure, m represents 0 or 1, and n represents an integer of not less than 1. The protective group Pro may be removable by light exposure in association with the photosensitizer (especially, a photo acid generator), or may be a hydrophobic protective group. The hydrophilic group may be a hydroxyl group or a carboxyl group. The photoactive compound has high sensitivity to a light source of short wavelength beams, for resist application, therefore, the photoactive compound is advantageously used for forming a pattern with high resolution.
    一种光活性化合物与光敏剂结合使用,由以下公式(1)表示: A −[( J ) m −( X-Pro )] n (1) 其中,A代表至少包括一种从烃基和杂环基中选择的疏水基的疏水单元,J代表连接基团,X-Pro代表由光照可去除的保护基团Pro保护的亲水基团,m代表0或1,n代表不少于1的整数。 保护基团Pro可以与光敏剂(特别是光酸发生剂)一起通过光照可去除,也可以是疏水保护基团。亲水基团可以是羟基或羧基。光活性化合物对短波长光源具有很高的敏感性,用于光刻应用,因此,该光活性化合物有利于形成具有高分辨率的图案。
  • COMPOUND FOR FORMING ORGANIC FILM, COMPOSITION FOR FORMING ORGANIC FILM, METHOD FOR FORMING ORGANIC FILM, AND PATTERNING PROCESS
    申请人:SHIN-ETSU CHEMICAL CO., LTD.
    公开号:US20170184968A1
    公开(公告)日:2017-06-29
    A compound for forming an organic film shown by the formula (1A), R—(—X) m1 (1A) wherein R represents a single bond or an organic group having 1 to 50 carbon atoms; X represents a group shown by formula (1B); and ml represents an integer satisfying 2≦m1≦10, wherein X 2 represents a divalent organic group having 1 to 10 carbon atoms; n1 represents 0 or 1; n2 represents 1 or 2; X 3 represents a group shown by the formula (1C); and n5 represents 0, 1, or 2, wherein R 10 represents a hydrogen atom or a saturated or unsaturated hydrocarbon group having 1 to 10 carbon atoms, wherein a hydrogen atom of the benzene ring in formula (1C) may be substituted with a methyl group or methoxy group. This compound for forming an organic film can provide organic film composition having good dry etching resistance, heat resistance to 400° C. or higher, high filling and planarizing properties.
    一种用于形成有机薄膜的化合物,其化学式为(1A),R—(—X)m1(1A),其中R代表一个单键或具有1至50个碳原子的有机基团;X代表化学式(1B)所示的基团;m1代表满足2≦m1≦10的整数,其中X2代表具有1至10个碳原子的二价有机基团;n1代表0或1;n2代表1或2;X3代表化学式(1C)所示的基团;n5代表0、1或2,其中R10代表氢原子或具有1至10个碳原子的饱和或不饱和碳氢基团,化学式(1C)中苯环的氢原子可能被甲基基团或甲氧基取代。这种用于形成有机薄膜的化合物可以提供具有良好干法刻蚀抗性、耐高温至400°C或更高、高填充和平整化性能的有机薄膜组合物。
  • OPTICALLY ACTIVE COMPOUND AND PHOTOSENSITIVE RESIN COMPOSITION
    申请人:Kansai Research Institute, Inc.
    公开号:EP1375463A1
    公开(公告)日:2004-01-02
    A photoactive compound is used in combination with a photosensitizer, represented by the following formula (1):         A-[(J)m-(X-Pro)]n     (1)    wherein A represents a hydrophobic unit comprising at least one kind of hydrophobic groups selected from a hydrocarbon group and a heterocyclic group, J represents a connecting group, X-Pro represents a hydrophilic group protected by a protective group Pro which is removable by light exposure, m represents 0 or 1, and n represents an integer of not less than 1. The protective group Pro may be removable by light exposure in association with the photosensitizer (especially, a photo acid generator), or may be a hydrophobic protective group. The hydrophilic group may be a hydroxyl group or a carboxyl group. The photoactive compound has high sensitivity to a light source of short wavelength beams, for resist application, therefore, the photoactive compound is advantageously used for forming a pattern with high resolution.
    光活性化合物与光敏剂结合使用,光敏剂由下式(1)表示: A-[(J)m-(X-Pro)]n (1) 其中 A 代表疏水单元,包括至少一种选自烃基和杂环基的疏水基团;J 代表连接基团;X-Pro 代表亲水基团,该亲水基团受保护基团 Pro 的保护,该保护基团可通过光照去除;m 代表 0 或 1;n 代表不小于 1 的整数。 保护基 Pro 可以通过与光敏剂(特别是光酸发生器)一起进行光照射而去除,也可以是疏水保护基。亲水基团可以是羟基或羧基。光活性化合物对短波长光束的光源具有很高的灵敏度,因此在抗蚀剂应用中,光活性化合物可用于形成具有高分辨率的图案。
  • Resist underlayer film composition, patterning process, and method for forming resist underlayer film
    申请人:SHIN-ETSU CHEMICAL CO., LTD.
    公开号:US10241412B2
    公开(公告)日:2019-03-26
    Provided is a resist underlayer film composition which is excellent in resistance to a basic hydrogen peroxide aqueous solution, in gap-filling and planarization characteristics, and in dry etching characteristic, wherein the resist underlayer film composition is used for a multilayer resist method, comprising: (A1) a polymer (1A) comprising one, or two or more, of a repeating unit represented by following general formula (1); (A2) one, or two or more, of a polyphenol compound having a formula weight of 2,000 or less and not having a 3,4-dihydroxy phenyl group; and (B) an organic solvent.
    本发明提供了一种抗蚀剂底层薄膜组合物,该组合物具有优异的抗碱性过氧化氢水溶液性能、间隙填充和平面化特性以及干蚀刻特性,其中该抗蚀剂底层薄膜组合物用于多层抗蚀剂方法,该抗蚀剂底层薄膜组合物包括:(A1) 聚合物 (1A),包括一个或两个或两个以上由以下通式 (1) 代表的重复单元;(A2) 一个或两个或两个以上的多酚化合物,其式重为 2,000 或以下,且不具有 3,4- 二羟基苯基;以及 (B) 有机溶剂。
  • Compound for forming organic film, composition for forming organic film, method for forming organic film, and patterning process
    申请人:SHIN-ETSU CHEMICAL CO., LTD.
    公开号:US10444628B2
    公开(公告)日:2019-10-15
    A compound for forming an organic film shown by the formula (1A), RX)m1  (1A) wherein R represents a single bond or an organic group having 1 to 50 carbon atoms; X represents a group shown by formula (1B); and m1 represents an integer satisfying 2≤m1≤10, wherein X2 represents a divalent organic group having 1 to 10 carbon atoms; n1 represents 0 or 1; n2 represents 1 or 2; X3 represents a group shown by the formula (1C); and n5 represents 0, 1, or 2, wherein R10 represents a hydrogen atom or a saturated or unsaturated hydrocarbon group having 1 to 10 carbon atoms, wherein a hydrogen atom of the benzene ring in formula (1C) may be substituted with a methyl group or methoxy group. This compound for forming an organic film can provide organic film composition having good dry etching resistance, heat resistance to 400° C. or higher, high filling and planarizing properties.
    一种用于形成式 (1A) 所示有机薄膜的化合物、 RX)m1 (1A) 其中 R 代表单键或具有 1 至 50 个碳原子的有机基团;X 代表式 (1B) 所示的基团;m1 代表满足 2≤m1≤10 的整数、 其中 X2 代表具有 1 至 10 个碳原子的二价有机基团;n1 代表 0 或 1;n2 代表 1 或 2;X3 代表式(1C)所示的基团;n5 代表 0、1 或 2、 其中 R10 代表氢原子或具有 1 至 10 个碳原子的饱和或不饱和烃基,其中式(1C)中苯环的氢原子可被甲基或甲氧基取代。这种用于形成有机薄膜的化合物可提供具有良好耐干蚀刻性、400° C 或更高耐热性、高填充性和平面化性能的有机薄膜组合物。
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