申请人:DAICEL CORPORATION
公开号:US20180134838A1
公开(公告)日:2018-05-17
Provided is a photocurable composition which less causes resin-induced swelling of molds, allows the molds to endure more satisfactorily, and has excellent economic efficiency. This photocurable composition includes components (A), (B), (C), and (D). The component (A) is present in a content of 10 to 50 weight percent of the totality of photocurable compounds contained in the photocurable composition. The component (A) is a cycloaliphatic epoxy compound represented by Formula (a). The component (B) is an oxetane compound having a solubility parameter of 9.5 (cal/cm
3
)
1/2
or more as determined by the Fedors' method. The component (C) is a glycidyl ether epoxy compound having a molecular weight of 250 or more. The component (D) is a photoinitiator:
wherein R
1
to R
18
are each, identically or differently, selected from hydrogen, halogen, a hydrocarbon group optionally containing oxygen or halogen, and optionally substituted alkoxy; and X is selected from a single bond and a linkage group.
提供的是一种光固化组合物,其引起模具树脂引起的膨胀较少,使模具更能承受,并具有优秀的经济效益。该光固化组合物包括组分(A),(B),(C)和(D)。组分(A)在光固化组合物中所含光固化化合物的总量的10至50重量%。组分(A)是由式(a)表示的环状脂肪族环氧化合物。组分(B)是具有由Fedors方法确定的溶解度参数为9.5(cal/cm3)1/2或更高的氧杂环丙烷化合物。组分(C)是具有分子量为250或更高的缩水甘油醚环氧化合物。组分(D)是光引发剂:其中R1到R18分别相同或不同地选择自氢,卤素,含氧或卤素的碳氢基团和可选择的取代烷氧基; X选择自单键和连接基团。