申请人:Murata Manufacturing Co., Ltd.
公开号:US20020106577A1
公开(公告)日:2002-08-08
Provided is a photosensitive copper paste permitting the formation of a fine and thick copper pattern having high adhesion to a substrate, and having excellent preservation stability without causing gelation, and a method of forming a copper pattern, a circuit board and a ceramic multilayer substrate using the photosensitive copper paste. The photosensitive copper paste includes a mixture of an organic binder having an acid functional group, a copper powder and a photosensitive organic component. The copper powder has a surface layer having a thickness of at least 0.1 &mgr;m from the surface composed CuO as a main component. The copper powder also has an oxygen content of about 0.8% to 5% by weight.
提供的是一种光敏铜浆料,可形成具有高附着力和优异保持稳定性的细且厚的铜图案,且不会引起凝胶化,以及使用该光敏铜浆料形成铜图案、电路板和陶瓷多层基板的方法。该光敏铜浆料包括有机粘合剂、铜粉和光敏有机成分的混合物。铜粉具有至少0.1μm厚的表面层,以CuO为主要成分。铜粉的氧含量约为0.8%至5%重量。