bis(3,5-diethyl-4-maleimidophenyl)methane | 105357-12-8

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: bis(3,5-diethyl-4-maleimidophenyl)methane
• 英文别名: di(3,5-diethyl-4-maleimido-phenyl)methane；di(3,5-diethyl-4-maleimidophenyl)methane；1-[4-[[4-(2,5-Dioxopyrrol-1-yl)-3,5-diethylphenyl]methyl]-2,6-diethylphenyl]pyrrole-2,5-dione
• CAS: 105357-12-8
• 化学式: C₂₉H₃₀N₂O₄
• 分子量: 470.568
• InChiKey: NHWYMYDMYCNUKI-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  5.3
• 重原子数：
  35
• 可旋转键数：
  8
• 环数：
  4.0
• sp3杂化的碳原子比例：
  0.31
• 拓扑面积：
  74.8
• 氢给体数：
  0
• 氢受体数：
  4

反应信息

• 作为产物：
  描述：

  马来酸酐 、 4,4'-亚甲基双(2,6-二乙基苯胺) 在 甲烷磺酸 作用下， 以 甲苯 为溶剂， 反应 1.5h， 以96%的产率得到bis(3,5-diethyl-4-maleimidophenyl)methane
  参考文献：
  名称：

  [EN] AMIDE-EXTENDED CROSSLINKING COMPOUNDS AND METHODS FOR USE THEREOF
  [FR] COMPOSÉS DE RÉTICULATION À EXTENSION D'AMIDE, ET LEURS PROCÉDÉS D'UTILISATION

  摘要：

  公开号：

  WO2010019832A3

文献信息

• Resin composition, prepreg and laminate using the same
  申请人：Nishimura Yoshimasa

  公开号：US20090110938A1

  公开（公告）日：2009-04-30

  A cyanate ester resin composition for a printed wiring board material containing a cyanate ester resin component A comprising a cyanate ester compound represented by the formula (1) and/or an oligomer thereof, and at least one component B selected from the group consisting of an epoxy resin and a maleimide compound, which resin composition is improved in heat resistance and heat resistance after moisture absorption, is excellent in mechanical properties such as elastic modulus and has flame retardancy without a halogen compound, and a prepreg and a laminate each of which uses the resin composition defined as above wherein the resin composition contains the component A and at least the epoxy resin as the component B.

  一种氰酸酯树脂组合物，用于印制线路板材料，包含氰酸酯树脂组分A，该组分A包括由式（1）表示的氰酸酯化合物和/或其寡聚物，并且至少包括从环氧树脂和马来酰亚胺化合物组成的群中选择的一种组分B。该树脂组合物在耐热性和吸湿后的耐热性方面得到改善，具有弹性模量等机械性能优异，并且具有无卤化合物的阻燃性。其中，预浸料和层压板各自使用定义如上的树脂组合物，其中树脂组合物包含组分A和至少环氧树脂作为组分B。
• CYANATE ESTER COMPOUND, CURABLE RESIN COMPOSITION CONTAINING CYANATE ESTER COMPOUND, AND CURED PRODUCT THEREOF
  申请人：Tsubuku Makoto

  公开号：US20130281640A1

  公开（公告）日：2013-10-24

  There is provided a novel dicyanatophenyl-based difunctional cyanate ester which is in a liquid form at ordinary temperature and can obtain a cured product having an excellent low thermal expansion rate. There is disclosed a cyanate ester compound represented by the following formula (I): (wherein R 1 represents a hydrocarbon group having 2 to 20 carbon atoms).

  提供一种新型双功能氰酸酯，基于二氰基苯，其在常温下呈液态，并可获得具有优异低热膨胀率的固化产物。公开了一种由以下式（I）表示的氰酸酯化合物：（其中R1表示具有2至20个碳原子的碳氢基团）。
• CURABLE RESIN COMPOSITION AND METHOD FOR MANUFACTURING CURED PRODUCT USING THE SAME
  申请人：Tsubuku Makoto

  公开号：US20140242394A1

  公开（公告）日：2014-08-28

  A curable resin composition which is in a liquid form at ordinary temperature and provides a cured product having excellent heat resistance and a low thermal expansion rate is provided. The curable resin composition according to the present invention comprises: a cyanate ester compound (A) represented by the following formula (I); and a curing accelerator (B): wherein R 1 represents a hydrocarbon group having 2 to 20 carbon atoms.

  提供一种可治愈的树脂组合物，其在常温下为液态，并提供具有优异耐热性和低热膨胀率的固化产品。根据本发明的可治愈树脂组合物包括：由以下式（I）表示的氰酸酯化合物（A）；以及固化促进剂（B）：其中R1代表具有2至20个碳原子的碳氢基团。
• METHOD OF PRODUCING POLYMER
  申请人：Japan as represented by President of Shizuoka University

  公开号：EP1598374A1

  公开（公告）日：2005-11-23

  A method of producing a polymer according to the present invention is characterized by comprising a step of photopolymerizing one or more photopolymerizable polymerization precursors by irradiation with an activation energy ray in a supercritical fluid or in a subcritical fluid.

  根据本发明生产聚合物的方法，其特征在于包括在超临界流体或亚临界流体中用活化能射线照射一种或多种可光聚合的聚合前体使其光聚合的步骤。
• Curable resin composition and its use
  申请人：MITSUBISHI GAS CHEMICAL COMPANY, INC.

  公开号：EP1605009A1

  公开（公告）日：2005-12-14

  A resin composition improved in resistance to crack and having elasticity and high heat resistance, which composition contains a cyanate ester resin (a) having at least two cyanate groups per molecule and a bismaleimide compound (b) represented by the following formula (1), a copper-clad laminate using the above resin composition and a printed wiring board using the above copper-clad laminate,    wherein n is an average value and is in the range of from 1 to 30.

  一种抗裂性更强、具有弹性和高耐热性的树脂组合物，该组合物包含一种氰酸酯树脂（a），其每个分子中至少有两个氰酸酯基团和一种双马来酰亚胺化合物（b），双马来酰亚胺化合物由下式（1）表示；一种使用上述树脂组合物的覆铜箔层压板和一种使用上述覆铜箔层压板的印刷线路板、 其中 n 为平均值，范围为 1 至 30。