申请人:Nippon Steel Chemical Co., Ltd.
公开号:EP1266926A1
公开(公告)日:2002-12-18
An adhesive polyimide resin which comprises a siloxane polyimide resin obtained from (A) an aromatic tetracarboxylic dianhydride and (B) a diamine ingredient comprising (B1) a diamine having a phenolic hydroxyl group, carboxyl group, or vinyl group as a crosslinkable reactive group and (B2) a siloxanediamine and has a glass transition temperature of 50 to 25 °C and a Young's modulus (storage modulus) at 25 ° C of 105 Pa or higher; and a laminate which comprises a substrate comprising a conductor layer and an insulating supporting layer having at least one polyimide resin layer and, disposed on a surface of the substrate, an adhesive layer comprising a layer of the adhesive polyimide resin. The adhesive polyimide resin and the laminate have satisfactory adhesion strength even after exposure to a high temperature of up to 27 °C and further have excellent heat resistance in reflow ovens. They are hence suitable for use in the bonding of electronic parts.
一种粘合剂聚酰亚胺树脂,它包括由(A)芳香族四羧酸二酐和(B)二胺成分得到的硅氧烷聚酰亚胺树脂,二胺成分包括(B1)具有酚羟基、羧基或乙烯基作为可交联反应基团的二胺和(B2)硅氧烷二胺,其玻璃化温度为50至25℃,25℃时的杨氏模量(储存模量)为105帕或更高;和一种层压板,它包括由导体层和绝缘支撑层组成的基板,绝缘支撑层具有至少一个聚酰亚胺树脂层,以及设置在基板表面上的由粘合聚酰亚胺树脂层组成的粘合层。粘合剂聚酰亚胺树脂和层压板即使暴露在高达 27 °C 的高温下也具有令人满意的粘合强度,而且在回流炉中具有优异的耐热性。因此,它们适用于电子零件的粘接。