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4,5-Diamino-1-hydroxyanthracene-9,10-dione | 90575-17-0

中文名称
——
中文别名
——
英文名称
4,5-Diamino-1-hydroxyanthracene-9,10-dione
英文别名
——
4,5-Diamino-1-hydroxyanthracene-9,10-dione化学式
CAS
90575-17-0
化学式
C14H10N2O3
mdl
——
分子量
254.24
InChiKey
LIYGRFAIVXOFDE-UHFFFAOYSA-N
BEILSTEIN
——
EINECS
——
  • 物化性质
  • 计算性质
  • ADMET
  • 安全信息
  • SDS
  • 制备方法与用途
  • 上下游信息
  • 反应信息
  • 文献信息
  • 表征谱图
  • 同类化合物
  • 相关功能分类
  • 相关结构分类

计算性质

  • 辛醇/水分配系数(LogP):
    2.7
  • 重原子数:
    19
  • 可旋转键数:
    0
  • 环数:
    3.0
  • sp3杂化的碳原子比例:
    0.0
  • 拓扑面积:
    106
  • 氢给体数:
    3
  • 氢受体数:
    5

文献信息

  • Method of manufacturing a photo-alignment layer
    申请人:The Hong Kong University of Science & Technology
    公开号:EP1209515A1
    公开(公告)日:2002-05-29
    A photo-alignment layer having excellent long-term stability to light and heat is manufactured by coating a material for the photo-alignment layer, which contains a dichroic dye having two or more polymerizable groups per molecule, on a substrate, and exposing the coating layer to polarized light, thereby imparting a photo-alignment function, and polymerizing the polymerizable groups by heating or light exposure.
    在基底上涂覆一种用于光配位层的材料,其中包含一种每分子具有两个或两个以上可聚合基团的二色性染料,然后将涂覆层暴露在偏振光下,从而赋予其光配位功能,并通过加热或光照射使可聚合基团聚合,从而制造出一种对光和热具有良好长期稳定性的光配位层。
  • ADHESIVE POLYIMIDE RESIN AND ADHESIVE LAMINATE
    申请人:Nippon Steel Chemical Co., Ltd.
    公开号:EP1266926A1
    公开(公告)日:2002-12-18
    An adhesive polyimide resin which comprises a siloxane polyimide resin obtained from (A) an aromatic tetracarboxylic dianhydride and (B) a diamine ingredient comprising (B1) a diamine having a phenolic hydroxyl group, carboxyl group, or vinyl group as a crosslinkable reactive group and (B2) a siloxanediamine and has a glass transition temperature of 50 to 25 °C and a Young's modulus (storage modulus) at 25 ° C of 105 Pa or higher; and a laminate which comprises a substrate comprising a conductor layer and an insulating supporting layer having at least one polyimide resin layer and, disposed on a surface of the substrate, an adhesive layer comprising a layer of the adhesive polyimide resin. The adhesive polyimide resin and the laminate have satisfactory adhesion strength even after exposure to a high temperature of up to 27 °C and further have excellent heat resistance in reflow ovens. They are hence suitable for use in the bonding of electronic parts.
    一种粘合剂聚酰亚胺树脂,它包括由(A)芳香族四羧酸二酐和(B)二胺成分得到的硅氧烷聚酰亚胺树脂,二胺成分包括(B1)具有酚羟基、羧基或乙烯基作为可交联反应基团的二胺和(B2)硅氧烷二胺,其玻璃化温度为50至25℃,25℃时的杨氏模量(储存模量)为105帕或更高;和一种层压板,它包括由导体层和绝缘支撑层组成的基板,绝缘支撑层具有至少一个聚酰亚胺树脂层,以及设置在基板表面上的由粘合聚酰亚胺树脂层组成的粘合层。粘合剂聚酰亚胺树脂和层压板即使暴露在高达 27 °C 的高温下也具有令人满意的粘合强度,而且在回流炉中具有优异的耐热性。因此,它们适用于电子零件的粘接。
  • Method of manufacturing photo-alignment layer
    申请人:HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY
    公开号:US20020098295A1
    公开(公告)日:2002-07-25
    A photo-alignment layer having excellent long-term stability to light and heat is manufactured by coating a material for the photo-alignment layer, which contains a dichroic dye having two or more polymerizable groups per molecule, on a substrate, and exposing the coating layer to polarized light, thereby imparting a photo-alignment function, and polymerizing the polymerizable groups by heating or light exposure.
    在基底上涂覆一种用于光配位层的材料,其中包含一种每分子具有两个或两个以上可聚合基团的二色性染料,然后将涂覆层暴露在偏振光下,从而赋予其光配位功能,并通过加热或光照射使可聚合基团聚合,从而制造出一种对光和热具有良好长期稳定性的光配位层。
  • Adhesive polyimide resin and adhesive laminate
    申请人:——
    公开号:US20030012882A1
    公开(公告)日:2003-01-16
    An adhesive polyimide resin which comprises a siloxane polyimide resin obtained from (A) an aromatic tetracarboxylic dianhydride and (B) a diamine ingredient comprising (B1) a diamine having a phenolic hydroxyl group, carboxyl group, or vinyl group as a crosslinkable reactive group and (B2) a siloxanediamine and has a glass transition temperature of 50 to 250□C and a Young's modulus (storage modulus) at 250□C of 10 5 Pa or higher; and a laminate which comprises a substrate comprising a conductor layer and an insulating supporting layer having at least one polyimide resin layer and, disposed on a surface of the substrate, an adhesive layer comprising a layer of the adhesive polyimide resin. The adhesive polyimide resin and the laminate have satisfactory adhesion strength even after exposure to a high temperature of up to 270□C and further have excellent heat resistance in reflow ovens. They are hence suitable for use in the bonding of electronic parts.
    一种粘合剂聚酰亚胺树脂,它由硅氧烷聚酰亚胺树脂组成,硅氧烷聚酰亚胺树脂由(A)芳香族四羧酸二酐和(B)二胺成分获得,二胺成分包括(B1)具有酚羟基、羧基或乙烯基作为可交联反应基团的二胺和(B2)硅氧烷二胺,其玻璃化温度为 50 至 250□C,250□C 时的杨氏模量(储存模量)为 10 5 帕或更高的杨氏模量(存储模量);以及一种层压板,该层压板包括由导体层和绝缘支撑层组成的基板,绝缘支撑层具有至少一个聚酰亚胺树脂层,以及设置在基板表面的由粘合剂聚酰亚胺树脂层组成的粘合剂层。即使在高达 270 摄氏度的高温下,粘合剂聚酰亚胺树脂和层压板仍具有令人满意的粘合强度,而且在回流炉中具有优异的耐热性。因此,它们适用于电子零件的粘接。
  • US6582776B2
    申请人:——
    公开号:US6582776B2
    公开(公告)日:2003-06-24
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