Methanone, (3,5-diaminophenyl)(4-(phenylethynyl)phenyl)- | 188479-24-5

• 分子结构分类: 有机化合物 - 苯丙烷和聚酮 - 二芳基庚烷
• 英文名称: Methanone, (3,5-diaminophenyl)(4-(phenylethynyl)phenyl)-
• 英文别名: (3,5-diaminophenyl)-[4-(2-phenylethynyl)phenyl]methanone
• CAS: 188479-24-5
• 化学式: C₂₁H₁₆N₂O
• 分子量: 312.4
• InChiKey: WLXDWBYHQVWPKE-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  3.9
• 重原子数：
  24
• 可旋转键数：
  4
• 环数：
  3.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  69.1
• 氢给体数：
  2
• 氢受体数：
  3

反应信息

• 作为产物：
  描述：

  3,5-Dinitro-4'-phenylethynylbenzophenone 、 1,4-二氧六环 、 在 ice 、 crude material 、 水 、 crude solid 、 crude product 、 甲苯 作用下， 以 盐酸 为溶剂， 反应 17.0h， 以to afford 13.1 g (80%) of a yellow powder, mp (DSC, 10° C./min) 156° C的产率得到Methanone, (3,5-diaminophenyl)(4-(phenylethynyl)phenyl)-
  参考文献：
  名称：

  Diamines containing pendent phenylethynyl groups

  摘要：

  制备了含有侧链苯乙炔基（PEPIs）和末端带有非反应性或苯乙炔基的控制分子量的咪唑寡聚物和共聚物，通过含有侧链苯乙炔基和末端带有非反应性或苯乙炔基的前体酰胺酸寡聚物或共聚物的环缩酰化反应制备。通过将二酸酐与过量的二胺和含有侧链苯乙炔基的二胺反应制备出胺端酰胺酸寡聚物或共聚物，随后使用苯乙炔基邻苯二甲酸酐或单官能团酐末端封闭。通过将二胺和含有侧链苯乙炔基的二胺与过量的二酸酐反应制备出酐端酰胺酸寡聚物或共聚物，随后使用苯乙炔基胺或单官能团胺末端封闭。在室温下，使用极性无水溶剂如N-甲基-2-吡咯烷酮和N,N-二甲基乙酰胺在氮气保护下进行聚合。然后，酰胺酸寡聚物或共聚物在热力学或化学条件下环缩酰化成相应的咪唑寡聚物。使用这些材料制备的聚合物和共聚物表现出独特且意外的性质组合，包括固化后更高的玻璃化转变温度，以及在潮湿条件下高达204°C的保持干净树脂、粘合剂和碳纤维增强机械性能，而不会牺牲熔融流动行为和加工性能。这些材料可用于粘合剂、涂料、薄膜、模塑和复合基质。

  公开号：

  US05689004A1

文献信息

• Phenylethynyl-containing imide silanes
  申请人：——

  公开号：US20030158351A1

  公开（公告）日：2003-08-21

  Phenylethynyl containing imide-silanes were prepared from aminoalkyl and aminoaryl alkoxy silanes and 4-phenyletbynylphthalic anhydride in toluene to form the imide in one step or in N-methyl-2-pyrrolidinone (NMP) to form the amide acid intermediate. Controlled molecular weight pendent phenylethynyl amide acid oligomers terminated with aminoaryl alkoxy silanes were prepared in NMP from aromatic dianhydrides, aromatic diamines, diamines containing pendent phenylethynyl groups and aminoaryl alkoxy silanes. The phenylethynyl containing imide-silanes and controlled molecular weight pendent phenylethynyl amide acid oligomers terminated with aminoaryl alkoxy silanes were used to improve the adhesion between phenylethynyl containing imide adhesives and inorganic substrates (i.e. metal). Hydrolysis of the alkoxy silane moiety formed a silanol functionality which reacted with the metal surface to form a metal-oxygen-silicon (oxane) bond under the appropriate reaction conditions. Upon thermal cure, the phenylethynyl group of the coupling agent reacts with the phenylethynyl functionality of phenylethynyl containing imide adhesives and becomes chemically bonded to the matrix. The resultant adhesive bond is more durable (i.e. hot-wet environmental resistance) than adhesive bonds made without the use of the coupling agent due to covalent bond formation between the phenylethynyl containing imide-silane coupling agent or the controlled molecular weight pendent phenylethynyl amide acid oligomers terminated with aminoaryl alkoxy silanes and both the metal substrate and phenylethynyl containing imide adhesives.

  苯乙炔基含有咪唑硅烷是通过在甲苯中使用氨基烷基和氨基芳基烷氧基硅烷以及4-苯乙炔基邻苯二甲酸酐一步法制备的咪唑化合物，或者在N-甲基-2-吡咯烷酮（NMP）中制备酰胺酸中间体。使用芳香二酸酐、芳香二胺、含苯乙炔基的二胺和氨基芳基烷氧基硅烷在NMP中制备了分子量可控的苯乙炔基末端的酰胺酸寡聚体。苯乙炔基含有咪唑硅烷和分子量可控的苯乙炔基末端的酰胺酸寡聚体被用来提高苯乙炔基含有咪唑胶粘剂与无机基底（如金属）之间的粘附力。硅烷的烷氧基水解成硅醇官能团，它在适当的反应条件下与金属表面反应形成金属-氧-硅（氧化物）键。在热固化过程中，偶联剂的苯乙炔基与苯乙炔基含有咪唑胶粘剂的苯乙炔基官能团反应，并与基质化学键合。由于苯乙炔基含有咪唑硅烷偶联剂或分子量可控的苯乙炔基末端的酰胺酸寡聚体与金属基底和苯乙炔基含有咪唑胶粘剂之间形成了共价键，所以形成的胶粘剂键更耐久（即具有热湿环境耐受性），比不使用偶联剂制备的胶粘剂键更为耐久。
• IMIDE OLIGOMERS AND CO-OLIGOMERS CONTAINING PENDENT PHENYLETHYNYL GROUPS AND POLYMERS THEREFROM
  申请人：NATIONAL AERONAUTICS AND SPACE ADMINISTRATION

  公开号：EP0842212A1

  公开（公告）日：1998-05-20
• EP0842212A4
  申请人：——

  公开号：EP0842212A4

  公开（公告）日：1998-10-14
• COMPOSITION OF AND METHOD FOR MAKING HIGH PERFORMANCE RESINS FOR INFUSION AND TRANSFER MOLDING PROCESSES
  申请人：The Government of the United States as represented by the Administrator of the National Aeronautics and Space Administration

  公开号：EP1189973A1

  公开（公告）日：2002-03-27
• DATA STORAGE MEDIUM AND METHOD FOR HIGH DENSITY DATA STORAGE
  申请人：Duerig Urs T.

  公开号：US20080076903A1

  公开（公告）日：2008-03-27

  A composition of matter for a recording medium in atomic force data storage devices. The composition includes polyimide oligomers having covalently bonded monomers forming a backbone, the oligomer thermally stable to at least 400° C.; one or more covalent bonding cross-linking moieties incorporated into the polyimide oligomer; and one or more hydrogen bonding cross-linking moieties incorporated into the polyimide oligomer. The covalent and hydrogen bonding cross-linking of the polyimide oligomers may be tuned to match thermal and force parameters required in read-write-erase cycles.