申请人:HITACHI CHEMICAL COMPANY, LTD.
公开号:US10940674B2
公开(公告)日:2021-03-09
The present invention provides a resin varnish, a prepreg, a laminate and a printed wiring board, using a thermosetting resin composition having high heat resistance, low relative permittivity, high metal foil adhesion, high glass transition temperature and low thermal expansion and excellent in moldability and platability. Specifically, the resin varnish contains (A) a maleimide compound, (B) an epoxy resin, (C) a copolymer resin having a structural unit derived from an aromatic vinyl compound and a structural unit derived from a maleic anhydride, (D) a silica treated with an aminosilane coupling agent, and (G) an organic solvent.
本发明提供了一种树脂清漆、一种预浸料、一种层压板和一种印刷线路板,其使用的热固性树脂组合物具有高耐热性、低相对介电常数、高金属箔附着力、高玻璃化转变温度和低热膨胀性,并具有优异的成型性和可印刷性。具体来说,该树脂清漆包含:(A) 马来酰亚胺化合物;(B) 环氧树脂;(C) 共聚物树脂,其结构单元来自芳香族乙烯基化合物和马来酸酐;(D) 用氨基硅烷偶联剂处理过的二氧化硅;(G) 有机溶剂。