[EN] METHODS FOR DEPOSITION OF MATERIALS INCLUDING MECHANICAL ABRASION<br/>[FR] PROCÉDÉS PERMETTANT LE DÉPÔT DE MATÉRIAUX COMPORTANT UNE ABRASION MÉCANIQUE
申请人:MASSACHUSETTS INST TECHNOLOGY
公开号:WO2013180801A1
公开(公告)日:2013-12-05
Methods described herein may be useful in the fabrication and/or screening of devices (e.g., sensors, circuits, etc.) including conductive materials. In some embodiments, a conductive material is formed on a substrate using mechanical abrasion. The methods described herein may be useful in fabricating sensors, circuits, tags for remotely-monitored sensors or human/object labeling and tracking, among other devices. In some cases, devices for determining analytes are also provided.