POSITIVE PHOTOSENSITIVE RESIN COMPOSITION FOR SPRAY COATING AND METHOD FOR PRODUCING THROUGH ELECTRODE USING THE SAME
申请人:SUMITOMO BAKELITE CO., LTD.
公开号:US20140113448A1
公开(公告)日:2014-04-24
A method for producing a through electrode includes providing a semiconductor wafer having an integrated circuit provided on a surface of the semiconductor wafer and a hole provided in the semiconductor wafer along a thickness direction of the semiconductor wafer. At least a portion of a back surface of an electrode of the integrated circuit is exposed through the hole. A positive photosensitive resin composition is sprayed to form a coating film so that the coating film covers an inner surface of the hole. The positive photosensitive resin composition has a viscosity of 0.5 to 200 cP and includes an alkali-soluble resin, a compound which generates an acid when exposed to light, and a solvent. At least a portion of the coating film is exposed and developed to form a coating film pattern.