Adhesive Film and Method for Manufacturing Semiconductor Device Using Same
申请人:Takamatsu Nobuhiro
公开号:US20080185700A1
公开(公告)日:2008-08-07
The invention provides an adhesive tape which acts as a dicing tape which is excellent in dicing property and pickup property in a dicing step, and as an adhesive tape which is excellent in connection reliability in a step of bonding a semiconductor device with a supporting member. The adhesive film comprises a layer in which an adhesive layer (A) comprising an olefin polymer and an adhesive layer (B) are directly laminated to each other, wherein the 180° peel strength between the layer (A) and the layer (B) is not more than 0.7 N/10 mm.
ZAJTSEVA E. L.; FLEROVA A. N.; GITINA R. M.; KURKOVSKAYA L. N.; TELESHOV +, ZH. ORGAN. XIMII <ZORK-AE>, 1976, 12, HO 9, 1987-1992
作者:ZAJTSEVA E. L.、 FLEROVA A. N.、 GITINA R. M.、 KURKOVSKAYA L. N.、 TELESHOV +