申请人:Henkel (China) Company Limited
公开号:US20150159059A1
公开(公告)日:2015-06-11
The present invention relates to an optical transparent dual cure adhesive, and process for preparing this dual cure adhesive, and uses thereof. More particularly, the present invention relates to optical transparent adhesive, which is both capable of being UV-light cured and thermal cured, for example, it can be used for the bonding of touch screen of an electronic device and substrate.