The present invention provides a resin composition which is capable of forming a roughened surface with low roughness on a surface of an insulating layer regardless of roughening conditions when used as a material of an insulating layer of a printed wiring board, and is excellent in adhesion between the insulating layer and a plated conductor layer, and also which has low thermal expansion coefficient (linear expansion coefficient) and high glass transition temperature and is also excellent in moist heat resistance. Disclosed is a resin composition including an epoxy compound (A), a cyanate ester compound (B) and an inorganic filler (C), wherein the cyanate ester compound (B) is at least one selected from the group consisting of a naphthol aralkyl type cyanate ester compound, an aromatic hydrocarbon formaldehyde type cyanate ester compound, a biphenyl aralkyl type cyanate ester compound and a novolak type cyanate ester compound; and the content of the epoxy compound (A) is 60 to 75% by weight based on the total amount of the epoxy compound (A) and the cyanate ester compound (B).
本发明提供了一种
树脂组合物,该
树脂组合物在用作印刷线路板绝缘层的材料时,无论粗化条件如何,都能够在绝缘层表面形成粗糙度较低的粗化表面,并且在绝缘层和电镀导体层之间具有优异的粘合性,还具有较低的热膨胀系数(线膨胀系数)和较高的
玻璃化转变温度,并且还具有优异的耐湿热性。公开了一种
树脂组合物,包括环氧化合物(A)、
氰酸酯化合物(B)和无机填料(C),其中
氰酸酯化合物(B)至少是从
萘酚芳烷基型
氰酸酯化合物、
芳香烃甲醛型
氰酸酯化合物、
联苯芳烷基型
氰酸酯化合物和
酚醛型
氰酸酯化合物组成的组中选出的一种;环氧化合物(A)的含量为环氧化合物(A)和
氰酸酯化合物(B)总量的 60% 至 75%(以重量计)。