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1,5-Bis[(4-isocyanato-3,5-dimethylphenyl)methyl]-2,4-dimethylbenzene

中文名称
——
中文别名
——
英文名称
1,5-Bis[(4-isocyanato-3,5-dimethylphenyl)methyl]-2,4-dimethylbenzene
英文别名
1,5-bis[(4-isocyanato-3,5-dimethylphenyl)methyl]-2,4-dimethylbenzene
1,5-Bis[(4-isocyanato-3,5-dimethylphenyl)methyl]-2,4-dimethylbenzene化学式
CAS
——
化学式
C28H28N2O2
mdl
——
分子量
424.5
InChiKey
GEVAKMWEOJOJQL-UHFFFAOYSA-N
BEILSTEIN
——
EINECS
——
  • 物化性质
  • 计算性质
  • ADMET
  • 安全信息
  • SDS
  • 制备方法与用途
  • 上下游信息
  • 反应信息
  • 文献信息
  • 表征谱图
  • 同类化合物
  • 相关功能分类
  • 相关结构分类

计算性质

  • 辛醇/水分配系数(LogP):
    9.6
  • 重原子数:
    32
  • 可旋转键数:
    6
  • 环数:
    3.0
  • sp3杂化的碳原子比例:
    0.29
  • 拓扑面积:
    58.9
  • 氢给体数:
    0
  • 氢受体数:
    4

文献信息

  • NOVEL CYANATE ESTER COMPOUND AND METHOD FOR PRODUCING THE SAME, AND CURABLE RESIN COMPOSITION COMPRISING THE COMPOUND, AND CURED PRODUCT THEREOF COMPOSITION
    申请人:Sugano Yuuichi
    公开号:US20140308530A1
    公开(公告)日:2014-10-16
    To provide a novel cyanate ester compound that can realize a cured product having low dielectric constant and dielectric loss tangent, and excellent flame retardancy and heat resistance, and moreover has relatively low viscosity, excellent solvent solubility, and also excellent handling properties, and a method for producing the cyanate ester compound, and a curable resin composition and the like using the cyanate ester compound. A phenol-modified xylene formaldehyde resin is cyanated.
    提供一种新型氰酸酯化合物,可以实现具有低介电常数和介质损耗正切值、优异的阻燃性和耐热性的固化产品,而且具有相对较低的粘度、优异的溶剂溶解性和处理性能,以及使用该氰酸酯化合物制备的方法,以及使用该氰酸酯化合物的可固化树脂组合物等。该氰酸酯化合物是通过对苯酚改性的甲醛甲苯树脂进行化反应得到的。
  • RESIN COMPOSITION, PREPREG, AND LAMINATE
    申请人:MITSUBISHI GAS CHEMICAL COMPANY, INC.
    公开号:US20140329066A1
    公开(公告)日:2014-11-06
    To provide a prepreg resin composition which has good solubility in a solvent and with which moreover a cured product having excellent flame resistance and a low water absorption rate can be made simply and with good reproducibility, and a prepreg and a laminate and a printed wiring board and the like using the same. The prepreg resin composition of the present invention including at least a cyanate compound (A) obtained by cyanation of a phenol-modified xylene formaldehyde resin, an epoxy resin (B), and an inorganic filler.
    提供一种预浸树脂组合物,该组合物在溶剂中具有良好的溶解性,并且使用该组合物可以简单地制备出具有优异防火性和低吸率的固化产物,并且具有良好的再现性。此外,本发明还提供使用该预浸树脂组合物的预浸料、层压板和印刷电路板等。该预浸树脂组合物包括至少一个通过对苯酚改性的二甲苯甲醛树脂进行基化反应得到的氰酸酯化合物(A)、环氧树脂(B)和无机填料。
  • NOVEL CYANIC ACID ESTER COMPOUND, METHOD FOR PRODUCING SAME, CURABLE RESIN COMPOSITION CONTAINING NOVEL CYANIC ACID ESTER COMPOUND, AND CURED PRODUCT OF CURABLE RESIN COMPOSITION
    申请人:Mitsubishi Gas Chemical Company, Inc.
    公开号:EP2743283A1
    公开(公告)日:2014-06-18
    To provide a novel cyanate ester compound that can realize a cured product having low dielectric constant and dielectric loss tangent, and excellent flame retardancy and heat resistance, and moreover has relatively low viscosity, excellent solvent solubility, and also excellent handling properties, and a method for producing the cyanate ester compound, and a curable resin composition and the like using the cyanate ester compound. A phenol-modified xylene formaldehyde resin is cyanated.
    提供一种新型氰酸酯化合物,它能使固化产品具有较低的介电常数和介电损耗正切、优异的阻燃性和耐热性,而且具有相对较低的粘度、优异的溶剂溶解性和优异的处理性能,并提供一种生产该氰酸酯化合物的方法和一种使用该氰酸酯化合物的可固化树脂组合物等。苯酚改性二甲苯甲醛树脂
  • RESIN COMPOSITION FOR PRINTED WIRING BOARD MATERIAL, AND PREPREG, RESIN SHEET, METAL FOIL-CLAD LAMINATE, AND PRINTED WIRING BOARD USING SAME
    申请人:Mitsubishi Gas Chemical Company, Inc.
    公开号:EP2810971A1
    公开(公告)日:2014-12-10
    The present invention provides a resin composition which is capable of forming a roughened surface with low roughness on a surface of an insulating layer regardless of roughening conditions when used as a material of an insulating layer of a printed wiring board, and is excellent in adhesion between the insulating layer and a plated conductor layer, and also which has low thermal expansion coefficient (linear expansion coefficient) and high glass transition temperature and is also excellent in moist heat resistance. Disclosed is a resin composition including an epoxy compound (A), a cyanate ester compound (B) and an inorganic filler (C), wherein the cyanate ester compound (B) is at least one selected from the group consisting of a naphthol aralkyl type cyanate ester compound, an aromatic hydrocarbon formaldehyde type cyanate ester compound, a biphenyl aralkyl type cyanate ester compound and a novolak type cyanate ester compound; and the content of the epoxy compound (A) is 60 to 75% by weight based on the total amount of the epoxy compound (A) and the cyanate ester compound (B).
    本发明提供了一种树脂组合物,该树脂组合物在用作印刷线路板绝缘层的材料时,无论粗化条件如何,都能够在绝缘层表面形成粗糙度较低的粗化表面,并且在绝缘层和电镀导体层之间具有优异的粘合性,还具有较低的热膨胀系数(线膨胀系数)和较高的玻璃化转变温度,并且还具有优异的耐湿热性。公开了一种树脂组合物,包括环氧化合物(A)、氰酸酯化合物(B)和无机填料(C),其中氰酸酯化合物(B)至少是从萘酚芳烷基型氰酸酯化合物、芳香烃甲醛氰酸酯化合物、联苯芳烷基型氰酸酯化合物和醛型氰酸酯化合物组成的组中选出的一种;环氧化合物(A)的含量为环氧化合物(A)和氰酸酯化合物(B)总量的 60% 至 75%(以重量计)。
  • MATERIAL FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, COMPOSITION FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY AND PATTERN FORMING METHOD
    申请人:Mitsubishi Gas Chemical Company, Inc.
    公开号:US20180101097A1
    公开(公告)日:2018-04-12
    A material for forming an underlayer film for lithography, including a cyanic acid ester compound obtained by cyanation of a modified xylene formaldehyde resin, a composition including the material, and a pattern forming method using the composition.
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