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[4-[[5-Methyl-2-prop-2-enoyloxy-3-[(4-prop-2-enoyloxyphenyl)methyl]phenyl]methyl]phenyl] prop-2-enoate

中文名称
——
中文别名
——
英文名称
[4-[[5-Methyl-2-prop-2-enoyloxy-3-[(4-prop-2-enoyloxyphenyl)methyl]phenyl]methyl]phenyl] prop-2-enoate
英文别名
[4-[[5-methyl-2-prop-2-enoyloxy-3-[(4-prop-2-enoyloxyphenyl)methyl]phenyl]methyl]phenyl] prop-2-enoate
[4-[[5-Methyl-2-prop-2-enoyloxy-3-[(4-prop-2-enoyloxyphenyl)methyl]phenyl]methyl]phenyl] prop-2-enoate化学式
CAS
——
化学式
C30H26O6
mdl
——
分子量
482.5
InChiKey
JDMOMRHLBOGVNS-UHFFFAOYSA-N
BEILSTEIN
——
EINECS
——
  • 物化性质
  • 计算性质
  • ADMET
  • 安全信息
  • SDS
  • 制备方法与用途
  • 上下游信息
  • 反应信息
  • 文献信息
  • 表征谱图
  • 同类化合物
  • 相关功能分类
  • 相关结构分类

计算性质

  • 辛醇/水分配系数(LogP):
    7.2
  • 重原子数:
    36
  • 可旋转键数:
    13
  • 环数:
    3.0
  • sp3杂化的碳原子比例:
    0.1
  • 拓扑面积:
    78.9
  • 氢给体数:
    0
  • 氢受体数:
    6

文献信息

  • BARRIER LAMINATE AND NOVEL POLYMER COMPOUND
    申请人:FUJIFILM Corporation
    公开号:US20140170345A1
    公开(公告)日:2014-06-19
    The present invention provides a barrier laminate with enhanced heat resistance performance, comprising at least one organic layer and at least one inorganic barrier layer, the organic layer being formed by curing a polymerizable composition comprising a polymerizable compound having two or more polymerizable groups, and the total quantity of uncured component in the organic layer being 1.5 weight % or less of the total weight of the organic layer, and a novel polymerizable compound that can preferably used as the polymerizable compound, which is denoted by general formula (11): in general formula (11), R 21 denotes hydrogen atom or methyl group; R 22 denotes methyl group or cyclohexyl group; n denotes an integer of 0 to 2; and each instance of X denotes a group comprising a polymerizable group.
  • US9458264B2
    申请人:——
    公开号:US9458264B2
    公开(公告)日:2016-10-04
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