(2Z,6E)-2,6-bis[[4-(diethylamino)phenyl]methylidene]-4-methylcyclohexan-1-one

• 分子结构分类: 有机化合物 - 苯丙烷和聚酮 - 二芳基庚烷
• 英文名称: (2Z,6E)-2,6-bis[[4-(diethylamino)phenyl]methylidene]-4-methylcyclohexan-1-one
• 化学式: C₂₉H₃₈N₂O
• 分子量: 430.6
• InChiKey: SFXPLYOSNTZJFW-NTDJFUTDSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  7
• 重原子数：
  32
• 可旋转键数：
  8
• 环数：
  3.0
• sp3杂化的碳原子比例：
  0.41
• 拓扑面积：
  23.6
• 氢给体数：
  0
• 氢受体数：
  3

文献信息

• Curable composition
  申请人：Asahi Kasei Kogyo Kabushiki Kaisha

  公开号：EP0203393A1

  公开（公告）日：1986-12-03

  A curable composition comprising (a) a curable polyimide soluble in organic solvents and (b) a polymerization initiator as essential components, said polyimide consisting of recurring units represented by the formula wherein, each of X, X1, X2, X3 and X4 is a tetravalent carbocyclic or heterocyclic residue, each of Y1, Y2 and Y3 is a divalent carbocyclic or heterocyclic residue, at least one of Z1 and Z2 is a residue having a reactive carbon-carbon double bond, and each of I, m, and n is an integer of 0 or larger.

  一种可固化组合物，包括(a)可溶于有机溶剂的可固化聚酰亚胺和(b)作为基本成分的聚合引发剂，所述聚酰亚胺由由式表示的递归单元组成 其中，X、X1、X2、X3 和 X4 中的每一个是四价碳环或杂环残基，Y1、Y2 和 Y3 中的每一个是二价碳环或杂环残基，Z1 和 Z2 中的至少一个是具有活性碳碳双键的残基，I、m 和 n 中的每一个是 0 或更大的整数。
• A precursor of a low thermal stress polyimide and a photopolymerizable composition containing a polyimide precursor
  申请人：Asahi Kasei Kogyo Kabushiki Kaisha

  公开号：EP0355927A2

  公开（公告）日：1990-02-28

  Disclosed is a polyimide precursor comprising a specific polyamic acid ester, polyamic amide or polyamic acid salt structure derived from a tetracarboxylic acid compound and a diamine compound, which can be converted by heating to a polyimide having low thermal stress. By blending a specific form of this novel polyimide precursor which has an ethylenic double bond, with a photopolymerization initiator, an excellent photopolymerizable composition can be obtained. Not only this precursor but also the crosslinked precursor obtained by the photopolymerization of the photopolymerizable composition can be converted by heating to a polyimide resin which has low thermal expansion coefficient, high heat resistance, excellent mechanical properties and satisfactory adhesion to a substrate. Hence, the precursor and the photopolymerizable composition can advantageously be utilized in the production of electrical and electronic components.

  本发明公开了一种聚酰亚胺前体，它由特定的聚酰胺酸酯、聚酰胺或聚酰胺酸盐结构组成，由四羧酸化合物和二胺化合物衍生而成，可通过加热转化为具有低热应力的聚酰亚胺。将这种具有乙烯双键的新型聚酰亚胺前体的特定形式与光聚合引发剂混合，可以得到一种极佳的光聚合组合物。不仅是这种前体，通过光聚合反应得到的交联前体也可以通过加热转化为聚酰亚胺树脂，这种树脂具有低热膨胀系数、高耐热性、优异的机械性能以及与基材的良好粘合性。因此，这种前体和可光聚合组合物可以很好地用于电气和电子元件的生产。
• Radiation sensitive polymer composition
  申请人：TORAY INDUSTRIES, INC.

  公开号：EP0418870A2

  公开（公告）日：1991-03-27

  A radiation-sensitive composition is described, which is comprised of (a) a polymer containing repeating units [1] represented by the general formula wherin R₁ is a trivalent or tetravalent organic residue having at least two carbon atoms, R₂ is a divalent organic residue having at least two carbon atoms, R₃ is hydrogen or an alkali metal counter ion, and n is 1 or 2; (b) a compound containing a radiation-dimerizable or radiation-polymerizable unsaturated bond and an amino group or a quaternary ammonium salt; (c) a non-alicyclic organic compound having a boiling point not lower than 120°C, containing at least one functional linkage selected from the group consisting of ester linkage, ether linkage and ketone linkage, and containing neither amino group nor hydroxyl group; and (d) optionally a sensitizer. This composition can greatly improve the developability and can give heat-resistant polyimide relief patterns with a good edge sharpness and good mechanical properties.

  描述了一种辐射敏感组合物，它包括 (a) 含有通式[1]代表的重复单元的聚合物 其中 R₁ 是至少具有两个碳原子的三价或四价有机残基，R₂ 是至少具有两个碳原子的二价有机残基，R₃ 是氢或碱金属反离子，n 是 1 或 2； (b) 含有可辐射二聚体或可辐射聚合的不饱和键和氨基或季铵盐的化合物； (c) 沸点不低于 120℃的非脂环有机化合物，含有至少一种选自酯连接、醚连接 和酮连接的官能连接，且既不含氨基也不含羟基；及 (d) 可选的敏化剂。 这种组合物能大大提高显影性，并能制作出边缘锐利、机械性能良好的耐热聚酰亚胺浮雕图案。
• Photosensitive resin composition and semiconductor apparatus using it
  申请人：SUMITOMO BAKELITE COMPANY LIMITED

  公开号：EP0430220A2

  公开（公告）日：1991-06-05

  The present invention provides a photosensitive resin composition which comprises as essential components: (A) a polyamic acid having a recurring unit represented by the following formula [I]: wherein 0.5-50 mol% of R₁ consists of a silicone diamine residue represented by the following formula [II]: wherein n represents an integer of 1-50, and the remainder of 50-99.5 mol% of R₁ consists of an organic group selected from the group consisting of an aromatic group, an aliphatic group, an alicyclic group, and a heterocyclic group, and R₂ consists of an organic group selected from the group consisting of an aromatic group, an aliphatic group, an alicyclic group, a heterocyclic group, and a silicone group, and m represents 1 or 2, (B) an amide compound having carbon-carbon double bond, and (C) a photosensitizer. The present invention further provides a semiconductor apparatus in which the above composition is used.

  本发明提供了一种光敏树脂组合物，其主要成分包括 (A) 具有下式[I]代表的递归单元的聚酰胺酸： 其中0.5-50 摩尔%的R₁由下式[II]代表的有机硅二胺残基组成： 其中n代表1-50的整数，其余50-99.5 mol％的R₁由选自芳香族基团、脂肪族基团、脂环族基团和杂环族基团的有机基团组成，R₂由选自芳香族基团、脂肪族基团、脂环族基团、杂环族基团和硅酮基团的有机基团组成，m代表1或2、 (B) 具有碳碳双键的酰胺化合物，和 (C) 一种光敏剂。 本发明进一步提供了一种使用上述组合物的半导体装置。
• Polyamic acid and polyimide from fluorinated reactant
  申请人：International Business Machines Corporation

  公开号：EP0538683A1

  公开（公告）日：1993-04-28

  Copolyamic acid is obtained from tetracarboxylic acid dianhydride, diamine and a fluorinated diamine and/or fluorinated tetracarboxylic acid dianhydride; and optionally ester or amine salt derivative thereof to obtain radiation sensitive polymer; and low optical high thermally stable polyimide from curing the above polyamic acid and/or derivative thereof.

  由四羧酸二酐、二胺、氟化二胺和/或氟化四羧酸二酐及其酯或胺盐衍生物制得共聚酰胺酸，从而获得辐射敏感聚合物；由上述聚酰胺酸和/或其衍生物固化得到低光学高热稳定性聚酰亚胺。