(2E,6Z)-2,6-bis[[4-(diethylamino)phenyl]methylidene]cyclohexan-1-one

• 分子结构分类: 有机化合物 - 苯丙烷和聚酮 - 二芳基庚烷
• 英文名称: (2E,6Z)-2,6-bis[[4-(diethylamino)phenyl]methylidene]cyclohexan-1-one
• 化学式: C₂₈H₃₆N₂O
• 分子量: 416.6
• InChiKey: LIFWPLOFXPGAJJ-FXYBLIFYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  6.8
• 重原子数：
  31
• 可旋转键数：
  8
• 环数：
  3.0
• sp3杂化的碳原子比例：
  0.39
• 拓扑面积：
  23.6
• 氢给体数：
  0
• 氢受体数：
  3

文献信息

• XANTHENE-BASED COMPOUND AND PHOTOSENSITIVE RESIN COMPOSITION COMPRISING SAME
  申请人：LG CHEM, LTD.

  公开号：US20200262807A1

  公开（公告）日：2020-08-20

  The present specification provides a compound represented by Chemical Formula 1, a colorant composition, a resin composition, a photosensitive material, a color filter and a display device comprising the same.

  当前规格书提供了一种由化学公式1表示的化合物，一种着色剂组合物，一种树脂组合物，一种光敏材料，以及包含该化合物的彩色滤光器和显示设备。
• SILANE-BASED COMPOUNDS AND PHOTOSENSITIVE RESIN COMPOSITION COMPRISING THE SAME
  申请人：CHO Changho

  公开号：US20130034814A1

  公开（公告）日：2013-02-07

  The present application relates to a new silane-based compound, a photosensitive resin composition including the same, and a photosensitive material including the same. The photosensitive resin composition including the silane-based compound according to the exemplary embodiment of the present application increases adhesion strength to a substrate, such that a developing property is excellent and there are no surface stains or defects during a subsequent process. Accordingly, a photosensitive material, a color filter and the like having excellent quality may be manufactured by using the photosensitive resin composition according to the exemplary embodiment of the present application.

  本申请涉及一种基于硅烷的新化合物，包括该化合物的感光树脂组合物，以及包括该化合物的感光材料。根据本申请示例实施方式的含硅烷基化合物的感光树脂组合物增加了与基材的粘附强度，使得显影性能优良，在随后的过程中没有表面污渍或缺陷。因此，通过使用根据本申请示例实施方式的感光树脂组合物可以制造出具有优良质量的感光材料、彩色滤光片等。
• Binder-mixtures for optical recording layers and elements
  申请人：EASTMAN KODAK COMPANY (a New Jersey corporation)

  公开号：EP0118881A2

  公开（公告）日：1984-09-19

  A solid, nonpolymeric amorphous mixture of compounds which is useful as a binder in optical recording elements is disclosed. The mixture comprises at least two different compounds each having at least two linking groups joining one multivalent organic nucleus with at least two organic nuclei wherein at least one of the multivalent organic nucleus and the organic nuclei is multicyclic. Methods for making such mixtures are also disclosed.

  本发明公开了一种固态非聚合无定形混合物，可用作光学记录元件的粘合剂。该混合物包括至少两种不同的化合物，每种化合物至少有两个连接基团，连接一个多价有机核和至少两个有机核，其中多价有机核和有机核中至少有一个是多环的。还公开了制造这种混合物的方法。
• Curable composition
  申请人：Asahi Kasei Kogyo Kabushiki Kaisha

  公开号：EP0203393A1

  公开（公告）日：1986-12-03

  A curable composition comprising (a) a curable polyimide soluble in organic solvents and (b) a polymerization initiator as essential components, said polyimide consisting of recurring units represented by the formula wherein, each of X, X1, X2, X3 and X4 is a tetravalent carbocyclic or heterocyclic residue, each of Y1, Y2 and Y3 is a divalent carbocyclic or heterocyclic residue, at least one of Z1 and Z2 is a residue having a reactive carbon-carbon double bond, and each of I, m, and n is an integer of 0 or larger.

  一种可固化组合物，包括(a)可溶于有机溶剂的可固化聚酰亚胺和(b)作为基本成分的聚合引发剂，所述聚酰亚胺由由式表示的递归单元组成 其中，X、X1、X2、X3 和 X4 中的每一个是四价碳环或杂环残基，Y1、Y2 和 Y3 中的每一个是二价碳环或杂环残基，Z1 和 Z2 中的至少一个是具有活性碳碳双键的残基，I、m 和 n 中的每一个是 0 或更大的整数。
• A precursor of a low thermal stress polyimide and a photopolymerizable composition containing a polyimide precursor
  申请人：Asahi Kasei Kogyo Kabushiki Kaisha

  公开号：EP0355927A2

  公开（公告）日：1990-02-28

  Disclosed is a polyimide precursor comprising a specific polyamic acid ester, polyamic amide or polyamic acid salt structure derived from a tetracarboxylic acid compound and a diamine compound, which can be converted by heating to a polyimide having low thermal stress. By blending a specific form of this novel polyimide precursor which has an ethylenic double bond, with a photopolymerization initiator, an excellent photopolymerizable composition can be obtained. Not only this precursor but also the crosslinked precursor obtained by the photopolymerization of the photopolymerizable composition can be converted by heating to a polyimide resin which has low thermal expansion coefficient, high heat resistance, excellent mechanical properties and satisfactory adhesion to a substrate. Hence, the precursor and the photopolymerizable composition can advantageously be utilized in the production of electrical and electronic components.

  本发明公开了一种聚酰亚胺前体，它由特定的聚酰胺酸酯、聚酰胺或聚酰胺酸盐结构组成，由四羧酸化合物和二胺化合物衍生而成，可通过加热转化为具有低热应力的聚酰亚胺。将这种具有乙烯双键的新型聚酰亚胺前体的特定形式与光聚合引发剂混合，可以得到一种极佳的光聚合组合物。不仅是这种前体，通过光聚合反应得到的交联前体也可以通过加热转化为聚酰亚胺树脂，这种树脂具有低热膨胀系数、高耐热性、优异的机械性能以及与基材的良好粘合性。因此，这种前体和可光聚合组合物可以很好地用于电气和电子元件的生产。