Phenyl 2-methylidenehexaneperoxoate

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: Phenyl 2-methylidenehexaneperoxoate
• 英文别名: phenyl 2-methylidenehexaneperoxoate
• 化学式: C₁₃H₁₆O₃
• 分子量: 220.26
• InChiKey: VPOCTCFONDOCAL-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  4.5
• 重原子数：
  16
• 可旋转键数：
  7
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.31
• 拓扑面积：
  35.5
• 氢给体数：
  0
• 氢受体数：
  3

文献信息

• Light stable transparent adhesive compositions and methods for use thereof
  申请人：Henkel IP & Holding GmbH

  公开号：US11174419B2

  公开（公告）日：2021-11-16

  Provided herein are high refractive index compositions with excellent light stability, and methods for the use thereof, as well as assemblies and articles prepared using invention formulations and methods.

  本文提供了具有优异光稳定性的高折射率组合物及其使用方法，以及使用本发明配方和方法制备的组件和物品。
• SYNTHESIS OF FUNCTIONAL POLYISOBUTYLENE-CONTAINING OLIGOMERS AND POLYMERS
  申请人：Henkel IP & Holding GmbH

  公开号：EP2948482A1

  公开（公告）日：2015-12-02
• LIGHT STABLE ADHESIVE COMPOSITIONS WITH HIGH REFRACTIVE INDEX AND ASSEMBLIES, ARTICLES, LIGHT EMITTING ELEMENTS THEREOF
  申请人：Henkel IP & Holding GmbH

  公开号：EP3507337A1

  公开（公告）日：2019-07-10
• LIGHT STABLE TRANSPARENT ADHESIVE COMPOSITIONS AND METHODS FOR USE THEREOF
  申请人：Henkel IP & Holdign GmbH

  公开号：US20190218434A1

  公开（公告）日：2019-07-18

  Provided herein are conductive formulations which are useful for applying conductive material to a suitable substrate; the resulting coated articles have improved EMI shielding performance relative to articles coated with prior art formulations employing prior art methods. In accordance with certain aspects of the present invention, there are also provided methods for filling a gap in an electronic package to achieve electromagnetic interference (EMI) shielding thereof, as well as the resulting articles shielded thereby. Specifically, invention methods utilize capillary flow to substantially fill any gaps in the coating on the surface of an electronic package. Effective EMI shielding has been demonstrated with very thin coating thickness.
• US9828454B2
  申请人：——

  公开号：US9828454B2

  公开（公告）日：2017-11-28