Plating compositions for electrolytic copper deposition, its use and a method for electrolytically depositing a copper or copper alloy layer onto at least one surface of a substrate
申请人:Atotech Deutschland GmbH
公开号:US10982343B2
公开(公告)日:2021-04-20
The present invention relates to a plating composition for electrolytic copper deposition, comprising copper ions, halide ions and at least one acid, at least one benzothiazole compound, at least one phenazine dye and at least one ethanediamine derivative. The present invention further concerns the use of above plating composition and a method for electrolytically depositing a copper or copper alloy layer onto at least one surface of a substrate.
本发明涉及一种用于电解沉铜的电镀组合物,该组合物包括铜离子、卤化物离子和至少一种酸、至少一种苯并噻唑化合物、至少一种吩嗪染料和至少一种乙二胺衍生物。本发明进一步涉及上述电镀组合物的使用以及在基底的至少一个表面上电解沉积铜或铜合金层的方法。