1,1'-(((Sulfonylbis(4,1-phenylene))bis(oxy))bis(4,1-phenylene))bis(1H-pyrrole-2,5-dione)

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 1,1'-(((Sulfonylbis(4,1-phenylene))bis(oxy))bis(4,1-phenylene))bis(1H-pyrrole-2,5-dione)
• 英文别名: 1-[4-[4-[4-[4-(2,5-dioxopyrrol-1-yl)phenoxy]phenyl]sulfonylphenoxy]phenyl]pyrrole-2,5-dione
• 化学式: C₃₂H₂₀N₂O₈S
• 分子量: 592.6
• InChiKey: NJMJISMIDHAPSG-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  4
• 重原子数：
  43
• 可旋转键数：
  8
• 环数：
  6.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  136
• 氢给体数：
  0
• 氢受体数：
  8

反应信息

• 作为产物：
  描述：

  4,4'-双(4-氨基苯氧基)二苯砜 生成 1,1'-(((Sulfonylbis(4,1-phenylene))bis(oxy))bis(4,1-phenylene))bis(1H-pyrrole-2,5-dione)
  参考文献：
  名称：

  KANAYAMA, KAORU;OGUMA, JOSINOBU

  摘要：

  DOI：

文献信息

• Process for producing allylsubstituted phenol compound and the product
  申请人：MITSUBISHI PETROCHEMICAL CO., LTD.

  公开号：EP0394949A2

  公开（公告）日：1990-10-31

  A process for producing an allyl-substituted phenol compound is described, which comprises a combi­nation of a first step in which a phenol is reacted with an allyl halide in the presence of an alkaline aqueous medium to allyl-etherify the phenol and a second step in which the reaction product obtained in the first step and containing the allyl-etherified phenol is subjected to a Claisen rearrangement reaction in the absence of a medium. Also, a compound obtained by the above process is described.

  本发明描述了一种生产烯丙基取代的苯酚化合物的工艺，该工艺包括两个步骤：第一步，在碱性水介质存在下，苯酚与烯丙基卤化物反应，使苯酚烯丙基醚化；第二步，在没有介质存在的情况下，对第一步得到的含有烯丙基醚化苯酚的反应产物进行克莱森重排反应。此外，还描述了通过上述工艺获得的一种化合物。
• Resin composition based on polymaleimide and phenolic aralkyl resin
  申请人：MITSUI TOATSU CHEMICALS, Inc.

  公开号：EP0471522A1

  公开（公告）日：1992-02-19

  A resin composition for sealing semiconductors comprises an organic component (A) which contains (a) a polymaleimide compound represented by the formula (I): wherein R₁ is a m-valent organic group having two or more carbon atoms and m is an integer of two or more and (b) a phenolic aralkyl resin represented by the formula (II): wherein X is a divalent group having the formula or , and n is an integer of from 0 to 100, or contains a mixture of the phenolic aralkyl resin and a phenol, and component (B) which contains an inorganic filler.

  一种用于密封半导体的树脂组合物包括有机组分 (A)，其中含有 (a) 由式 (I) 表示的聚马来酰亚胺化合物： 其中 R₁ 是具有两个或两个以上碳原子的 m 价有机基团，m 是两个或两个以上的整数；以及 (b) 由式 (II) 表示的酚醛芳基树脂： 其中 X 是具有以下式子的二价基团 或 的二价基团，且 n 为 0 至 100 的整数，或含有酚醛芳基树脂和苯酚的混合物，以及含有无机填料的组分 (B)。
• RESIN PASTE FOR DIE BONDING AND ITS USE
  申请人：Hitachi Chemical Co., Ltd.

  公开号：EP1758157A1

  公开（公告）日：2007-02-28

  Disclosed is a resin paste for die bonding comprising a butadiene homopolymer or copolymer (A) having a carboxylic acid terminal group, a thermosetting resin (B), a filler (C), and a printing solvent (D), wherein the elastic modulus of the resin paste following drying and curing is within a range from 1 to 300 MPa (25°C). The solid fraction is preferably from 40 to 90% by weight, the thixotropic index is preferably from 1.5 to 8.0, and the viscosity (25°C) is preferably from 5 to 1,000 Pa·s. Using this resin paste, a semiconductor device is produced by a method comprising (1) applying a predetermined quantity of the resin paste to a substrate, (2) drying the resin paste to effect B-staging of the resin, (3) mounting a semiconductor chip on the B-staged resin, and (4) conducting post-curing of the resin.

  本发明公开了一种用于模具粘接的树脂糊，该树脂糊由具有羧酸末端基团的丁二烯均聚物或共聚物（A）、热固性树脂（B）、填料（C）和印刷溶剂（D）组成，其中树脂糊在干燥和固化后的弹性模量范围为 1 至 300 兆帕（25°C）。按重量计，固体部分最好为 40% 至 90%，触变指数最好为 1.5 至 8.0，粘度（25°C）最好为 5 至 1,000 Pa-s。使用这种树脂糊生产半导体器件的方法包括：(1) 将预定量的树脂糊涂在基板上；(2) 干燥树脂糊，使树脂 B 阶段化；(3) 在 B 阶段化的树脂上安装半导体芯片；(4) 对树脂进行后固化。
• PHOTOSENSITIVE ADHESIVE COMPOSITION, AND OBTAINED USING THE SAME, ADHESIVE FILM, ADHESIVE SHEET, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, SEMICONDUCTOR DEVICE AND ELECTRONIC PART
  申请人：Hitachi Chemical Company, Ltd.

  公开号：EP1901123A1

  公开（公告）日：2008-03-19

  A photosensitive adhesive composition comprising: (A) a polyimide having a carboxyl group as a side chain, whereof the acid value is 80 to 180 mg/KOH; (B) a photo-polymerizable compound; and (C) a photopolymerization initiator.

  一种光敏粘合剂组合物，包括：(A) 具有羧基作为侧链的聚酰亚胺，其酸值为 80 至 180 mg/KOH；(B) 可光聚合的化合物；以及 (C) 光聚合引发剂。
• ADHESIVE FILM AND SEMICONDUCTOR DEVICE USING SAME
  申请人：Hitachi Chemical Company, Ltd.

  公开号：EP1918341A1

  公开（公告）日：2008-05-07

  The present invention relates to an adhesive film comprising a polyimide resin (A) and a thermosetting resin (B), wherein the polyimide resin (A) comprises a polyimide resin having a repeating unit represented by a formula (I) shown below, and the storage elastic modulus of the adhesive film at 250°C, following heat treatment at a temperature of 150 to 230°C for a period of 0.3 to 5 hours, is not less than 0.2 MPa: (wherein, the m R1 groups each represent, independently, a bivalent organic group, the m R1 groups include a total of k organic groups selected from the group consisting of -CH2-, -CHR- and -CR2- (wherein, R represents a non-cyclic alkyl group of 1 to 5 carbon atoms), m represents an integer of not less than 8, m and k satisfy a relationship: k/m ≥ 0.85, and R2 represents a tetracarboxylic acid residue).

  本发明涉及一种由聚酰亚胺树脂（A）和热固性树脂（B）组成的胶膜，其中聚酰亚胺树脂（A）由具有下图所示式（I）代表的重复单元的聚酰亚胺树脂组成，在 150 至 230°C 的温度下进行 0.3 至 5 小时的热处理后，胶膜在 250°C 下的存储弹性模量不小于 0.2 兆帕： (其中，m个R1基团各自独立地代表一个二价有机基团，m个R1基团包括总共k个有机基团，这些有机基团选自由-CH2-、-CHR-和-CR2-组成的组(其中，R代表1至5个碳原子的非环烷基)，m代表不小于8的整数，m和k满足一种关系：k/m≥0.85，R2代表四羧酸残基)。