9,10-diglycidyl anthracene ether | 155665-67-1

• 分子结构分类: 有机化合物 - 苯类化合物 - 蒽
• 英文名称: 9,10-diglycidyl anthracene ether
• 英文别名: 2-[[10-(Oxiran-2-ylmethoxy)anthracen-9-yl]oxymethyl]oxirane
• CAS: 155665-67-1
• 化学式: C₂₀H₁₈O₄
• 分子量: 322.361
• InChiKey: HQTGKBNXVCVDOY-UHFFFAOYSA-N

物化性质

• 沸点：
  540.9±20.0 °C(predicted)
• 密度：
  1.308±0.06 g/cm3(Temp: 20 °C; Press: 760 Torr)(predicted)

计算性质

• 辛醇/水分配系数(LogP)：
  3.7
• 重原子数：
  24
• 可旋转键数：
  6
• 环数：
  5.0
• sp3杂化的碳原子比例：
  0.3
• 拓扑面积：
  43.5
• 氢给体数：
  0
• 氢受体数：
  4

反应信息

• 作为反应物：
  描述：

  9,10-diglycidyl anthracene ether 、 二氧化碳 在 四丁基溴化铵 作用下， 20.0~150.0 ℃ 、2.41 MPa 条件下， 生成 4-[[10-[(2-Oxo-1,3-dioxolan-4-yl)methoxy]anthracen-9-yl]oxymethyl]-1,3-dioxolan-2-one
  参考文献：
  名称：

  WO2008/139315

  摘要：

  公开号：

文献信息

• COMPOSITION COMPRISING POLYMER HAVING ETHYLENE-DICARBONYL STRUCTURE FOR USE IN FORMING ANTI-REFLECTIVE COATING FOR LITHOGRAPHY
  申请人：Nissan Chemical Industries, Ltd.

  公开号：EP1876495A1

  公开（公告）日：2008-01-09

  There is provided an anti-reflective coating forming composition for lithography comprising a polymer having an ethylenedicarbonyl structure and a solvent; an anti-reflective coating formed from the composition; and a method for forming photoresist pattern by use of the composition. The anti-reflective coating obtained from the composition can be used in lithography process for manufacturing a semiconductor device, has a high preventive effect for reflected light, causes no intermixing with photoresists, and has a higher etching rate than photoresists.

  本发明提供了一种光刻用抗反射涂层形成组合物，该组合物包含具有亚乙基二羰基结构的聚合物和溶剂；由该组合物形成的抗反射涂层；以及使用该组合物形成光刻胶图案的方法。由该组合物制得的抗反射涂层可用于制造半导体器件的光刻工艺中，对反射光有很好的防止效果，不会与光刻胶混合，而且蚀刻率高于光刻胶。
• ADHESIVE COMPOSITION, ADHESIVE TAPE, METHOD FOR PROCESSING SEMICONDUCTOR WAFER AND METHOD FOR PRODUCING TSV WAFER
  申请人：Sekisui Chemical Co., Ltd.

  公开号：EP2551323A1

  公开（公告）日：2013-01-30

  The present invention aims to provide an adhesive composition having high adhesive strength, as well as being easily detachable and having excellent heat resistance, an adhesive tape comprising the adhesive composition, a method for treating a semiconductor wafer using the adhesive tape, and a method for producing a TSV wafer. The present invention relates to an adhesive composition comprising: an adhesive component; and a tetrazole compound represented by the following formula (1), formula (2), or formula (3), or its salt: wherein R1 and R2 each may be hydrogen, a hydroxy group, an amino group, or a C1-C7 alkyl group, alkylene group, phenyl group, or mercapto group; and the C1-C7 alkyl group, alkylene group, phenyl group, and mercapto group may be substituted.

  本发明旨在提供一种具有高粘合强度、易剥离且具有优异耐热性的粘合剂组合物、一种包含该粘合剂组合物的胶带、一种使用该胶带处理半导体晶片的方法以及一种生产TSV晶片的方法。本发明涉及一种粘合剂组合物，包括：粘合剂成分；以及由下式（1）、式（2）或式（3）代表的四唑化合物或其盐： 其中 R1 和 R2 可分别为氢、羟基、氨基或 C1-C7 烷基、亚烷基、苯基或巯基；且 C1-C7 烷基、亚烷基、苯基和巯基可被取代。
• RESIN COMPOSITION FOR PRINTED WIRING BOARD MATERIAL, AND PREPREG, RESIN SHEET, METAL FOIL-CLAD LAMINATE, AND PRINTED WIRING BOARD USING SAME
  申请人：Mitsubishi Gas Chemical Company, Inc.

  公开号：EP2810971A1

  公开（公告）日：2014-12-10

  The present invention provides a resin composition which is capable of forming a roughened surface with low roughness on a surface of an insulating layer regardless of roughening conditions when used as a material of an insulating layer of a printed wiring board, and is excellent in adhesion between the insulating layer and a plated conductor layer, and also which has low thermal expansion coefficient (linear expansion coefficient) and high glass transition temperature and is also excellent in moist heat resistance. Disclosed is a resin composition including an epoxy compound (A), a cyanate ester compound (B) and an inorganic filler (C), wherein the cyanate ester compound (B) is at least one selected from the group consisting of a naphthol aralkyl type cyanate ester compound, an aromatic hydrocarbon formaldehyde type cyanate ester compound, a biphenyl aralkyl type cyanate ester compound and a novolak type cyanate ester compound; and the content of the epoxy compound (A) is 60 to 75% by weight based on the total amount of the epoxy compound (A) and the cyanate ester compound (B).

  本发明提供了一种树脂组合物，该树脂组合物在用作印刷线路板绝缘层的材料时，无论粗化条件如何，都能够在绝缘层表面形成粗糙度较低的粗化表面，并且在绝缘层和电镀导体层之间具有优异的粘合性，还具有较低的热膨胀系数（线膨胀系数）和较高的玻璃化转变温度，并且还具有优异的耐湿热性。公开了一种树脂组合物，包括环氧化合物（A）、氰酸酯化合物（B）和无机填料（C），其中氰酸酯化合物（B）至少是从萘酚芳烷基型氰酸酯化合物、芳香烃甲醛型氰酸酯化合物、联苯芳烷基型氰酸酯化合物和酚醛型氰酸酯化合物组成的组中选出的一种；环氧化合物（A）的含量为环氧化合物（A）和氰酸酯化合物（B）总量的 60% 至 75%（以重量计）。
• GAS GENERATING MATERIAL, AND MICROPUMP
  申请人：Sekisui Chemical Co., Ltd.

  公开号：EP2860167A1

  公开（公告）日：2015-04-15

  Provided is a gas-generating material which can generate a gas in a large amount per unit time and has high storage stability. The gas-generating material 11a according to the present invention comprises a gas-generating agent that is an azo compound or an azide compound, a tertiary amine, a photosensitizing agent and a binder resin.

  本发明提供了一种可在单位时间内产生大量气体且储存稳定性高的气体发生材料。 根据本发明，气体发生材料 11a 包括偶氮化合物或叠氮化合物气体发生剂、叔胺、光敏剂和粘合剂树脂。
• GAS-GENERATING MATERIAL AND MICROPUMP
  申请人：Sekisui Chemical Co., Ltd.

  公开号：EP2907798A1

  公开（公告）日：2015-08-19

  Provided is a gas-generating material which exhibits a high adhesive property to a member to be adhered and which makes it possible to generate a gas in a large amount per unit time even when the gas-generating material contains a silane coupling agent. The gas-generating material according to the present invention contains: a binder resin; a gas-generating agent which is an azo compound or an azide compound; and a silane coupling agent having an amino group.

  本发明提供了一种气体发生材料，该材料对要粘合的构件具有高粘合性，即使在气体发生材料含有硅烷偶联剂的情况下，也能在单位时间内产生大量气体。本发明的气体发生材料包含：粘合剂树脂；偶氮化合物或叠氮化物气体发生剂；以及具有氨基的硅烷偶联剂。