4-{4-[(4-{3,5-Dioxo-4-azatricyclo[5.2.1.0^{2,6}]dec-8-en-4-yl}phenyl)methyl]phenyl}-4-azatricyclo[5.2.1.0^{2,6}]dec-8-ene-3,5-dione | 22499-39-4

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 4-{4-[(4-{3,5-Dioxo-4-azatricyclo[5.2.1.0^{2,6}]dec-8-en-4-yl}phenyl)methyl]phenyl}-4-azatricyclo[5.2.1.0^{2,6}]dec-8-ene-3,5-dione
• 英文别名: 4-[4-[[4-(3,5-dioxo-4-azatricyclo[5.2.1.02,6]dec-8-en-4-yl)phenyl]methyl]phenyl]-4-azatricyclo[5.2.1.02,6]dec-8-ene-3,5-dione
• CAS: 22499-39-4；85649-03-2；85649-04-3
• 化学式: C₃₁H₂₆N₂O₄
• mdl: MFCD00310628
• 分子量: 490.558
• InChiKey: LTSYMGSWVPHCEO-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  3.7
• 重原子数：
  37
• 可旋转键数：
  4
• 环数：
  8.0
• sp3杂化的碳原子比例：
  0.35
• 拓扑面积：
  74.8
• 氢给体数：
  0
• 氢受体数：
  4

反应信息

• 作为反应物：
  描述：

  4-{4-[(4-{3,5-Dioxo-4-azatricyclo[5.2.1.0^{2,6}]dec-8-en-4-yl}phenyl)methyl]phenyl}-4-azatricyclo[5.2.1.0^{2,6}]dec-8-ene-3,5-dione 生成
  参考文献：
  名称：

  Polyimide Aerogels by Ring-Opening Metathesis Polymerization (ROMP)

  摘要：

  Polyimide aerogel monoliths are prepared by ring-opening metathesis polymerization (ROMP) of a norbornene end-capped diimide, bis-NAD, obtained as the condensation product of radic anhydride with 4,4'-methylenedianiline. The density of the material was varied in the range of 0.13-0.66 g cm(-3) by varying the concentration of bis-NAD in the sol. Wet gels experience significant shrinkage, relative to their molds (28%-39% in linear dimensions), but the final aerogels retain high porosities (50%-90% v/v), high surface areas (210-632 m(2) g(-1), of which up to 25% is traced to micropores), and pore size distributions in the mesoporous range (20-33 nm). The skeletal framework consists of primary particles 16-17 nm in diameter, assembling to form secondary aggregates (by SANS and SEM) 60-85 nm in diameter. At lower densities (e.g., 0.26 g cm(-3)), secondary particles are mass fractals (D-m = 2.34 +/- 0.03) turning to closed-packed surface fractal objects (D-S = 3.0) as the bulk density increases (>= 0.34 g cm(-3)), suggesting a change in the network-forming mechanism from diffusion-limited aggregation of primary particles to a space-filling bond percolation model. The new materials combine facile one-step synthesis with heat resistance up to 200 C, high mechanical compressive strength and specific energy absorption (168 MPa and 50J g(-1), respectively, at 0,39 g cm(-3) and 88% ultimate strain), low speed of sound (351 m s(-1) at 0.39 g cm(-3)) and styrofoam-like thermal conductivity (0.031 W m(-1) K-1 at 0.34 g cm(-3) and 25 degrees C); hence, they are reasonable multifunctional candidate materials for further exploration as thermal/acoustic insulation at elevated temperatures.

  DOI：

  10.1021/cm200323e
• 作为产物：
  描述：

  3-[[4-[[4-[(3-carboxybicyclo[2.2.1]hept-5-ene-2-carbonyl)amino]phenyl]methyl]phenyl]carbamoyl]bicyclo[2.2.1]hept-5-ene-2-carboxylic acid 在 吡啶 、 乙酸酐 作用下， 以 N-甲基吡咯烷酮 为溶剂， 反应 6.0h， 以2 g的产率得到4-{4-[(4-{3,5-Dioxo-4-azatricyclo[5.2.1.0^{2,6}]dec-8-en-4-yl}phenyl)methyl]phenyl}-4-azatricyclo[5.2.1.0^{2,6}]dec-8-ene-3,5-dione
  参考文献：
  名称：

  Polyimide Aerogels by Ring-Opening Metathesis Polymerization (ROMP)

  摘要：

  Polyimide aerogel monoliths are prepared by ring-opening metathesis polymerization (ROMP) of a norbornene end-capped diimide, bis-NAD, obtained as the condensation product of radic anhydride with 4,4'-methylenedianiline. The density of the material was varied in the range of 0.13-0.66 g cm(-3) by varying the concentration of bis-NAD in the sol. Wet gels experience significant shrinkage, relative to their molds (28%-39% in linear dimensions), but the final aerogels retain high porosities (50%-90% v/v), high surface areas (210-632 m(2) g(-1), of which up to 25% is traced to micropores), and pore size distributions in the mesoporous range (20-33 nm). The skeletal framework consists of primary particles 16-17 nm in diameter, assembling to form secondary aggregates (by SANS and SEM) 60-85 nm in diameter. At lower densities (e.g., 0.26 g cm(-3)), secondary particles are mass fractals (D-m = 2.34 +/- 0.03) turning to closed-packed surface fractal objects (D-S = 3.0) as the bulk density increases (>= 0.34 g cm(-3)), suggesting a change in the network-forming mechanism from diffusion-limited aggregation of primary particles to a space-filling bond percolation model. The new materials combine facile one-step synthesis with heat resistance up to 200 C, high mechanical compressive strength and specific energy absorption (168 MPa and 50J g(-1), respectively, at 0,39 g cm(-3) and 88% ultimate strain), low speed of sound (351 m s(-1) at 0.39 g cm(-3)) and styrofoam-like thermal conductivity (0.031 W m(-1) K-1 at 0.34 g cm(-3) and 25 degrees C); hence, they are reasonable multifunctional candidate materials for further exploration as thermal/acoustic insulation at elevated temperatures.

  DOI：

  10.1021/cm200323e

文献信息

• INSULATING LAYER FOR PRINTED WIRE BOARD, AND PRINTED WIRE BOARD
  申请人：Mitsubishi Gas Chemical Company, Inc.

  公开号：EP3094162A1

  公开（公告）日：2016-11-16

  The present invention provides an insulating layer for printed circuit boards having a difference of within 20% between the flexural modulus at 25°C and the flexural modulus under heat at 250°C.

  本发明提供了一种用于印刷电路板的绝缘层，其在 25°C 时的弯曲模量与在 250°C 受热时的弯曲模量之差在 20% 以内。
• RESIN COMPOSITION, RESIN FILM, METHOD FOR PRODUCING RESIN FILM, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
  申请人：Shin-Etsu Chemical Co., Ltd.

  公开号：EP3228653A1

  公开（公告）日：2017-10-11

  The present invention provides a resin composition including: (A) a silicone resin containing a constitutional unit shown by the following composition formula (1) and having a weight average molecular weight of 3,000 to 500,000, (B) an epoxy resin-curing agent; and (C) a filler. This can provide a resin composition and a resin film that can mold a wafer in a lump, has good molding properties particularly to a thin-film wafer having a large diameter, gives low-warping properties, as well as good wafer protection performance, good adhesion properties, high reliability, and good heat resistance after molding, can perform a molding process favorably, and can be used for wafer level packaging favorably. The present invention also provides a method for producing the resin film, a semiconductor device molded with the resin film, and a method for producing the semiconductor device.

  本发明提供了一种树脂组合物，其中包括：(A)硅树脂，该硅树脂含有如下组成式(1)所示的组成单元，其重量平均分子量为 3,000 至 500,000；(B)环氧树脂固化剂；以及(C)填料。本发明提供了一种树脂组合物和树脂薄膜，该树脂组合物和树脂薄膜可以块状模塑晶片，特别是对直径较大的薄膜晶片具有良好的模塑性能，具有低翘曲性能，以及良好的晶片保护性能、良好的粘合性能、高可靠性和模塑后良好的耐热性，可以很好地执行模塑工艺，并可以很好地用于晶片级封装。本发明还提供了一种生产该树脂薄膜的方法、一种用该树脂薄膜模塑的半导体器件以及一种生产该半导体器件的方法。
• Sillion, Bernard; Mercier, Regis; Audigier, Dominique, Bulletin des Societes Chimiques Belges, 1989, vol. 98, # 9-10, p. 751 - 760
  作者：Sillion, Bernard、Mercier, Regis、Audigier, Dominique、Pascal, Thierry

  DOI：——

  日期：——
• SOLNTSEV A. P.; NEZHVITSKAYA G. B.; VOLOZHIN A. I.; PAUSHKIN YA. M., VESTSI BSSR, CEP. XIM. N., IZV. AN BSSR, CEP. XIM. N. <IANV-R5>, 1975, HO+
  作者：SOLNTSEV A. P.、 NEZHVITSKAYA G. B.、 VOLOZHIN A. I.、 PAUSHKIN YA. M.

  DOI：——

  日期：——
• LIQUID CRYSTAL ALIGNING AGENTS FOR FORMING PHOTO-ALIGNING LIQUID CRYSTAL ALIGNMENT LAYERS, LIQUID CRYSTAL ALIGNMENT LAYERS AND LIQUID CRYSTAL DISPLAY DEVICES USING THE SAME
  申请人：JNC CORPORATION

  公开号：US20150105503A1

  公开（公告）日：2015-04-16

  A photo-aligning liquid crystal alignment layer formed by using a photo-aligning liquid crystal aligning agent containing polyamic acid or a derivative thereof which is synthesized by using tetracarboxylic acid dianhydride having no photoreactive structure having a specific structure and diamine having no photoreactive structure having a specific structure together with at least one of tetracarboxylic acid dianhydride having a photoreactive structure and diamine having a photoreactive structure can reduce storage of residual DC in a liquid crystal display device. Further, the above alignment layer can shorten the relaxation time and can prevent afterimages from being generated.