triethyl-phenethyl-ammonium; iodide | 64049-55-4

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: triethyl-phenethyl-ammonium; iodide
• 英文别名: Triaethyl-phenaethyl-ammonium; Jodid；beta-Phenylethyltriethylammonium iodide；triethyl(2-phenylethyl)azanium;iodide
• CAS: 64049-55-4
• 化学式: C₁₄H₂₄N*I
• 分子量: 333.256
• InChiKey: GZMBXXRBVFJEPW-UHFFFAOYSA-M

计算性质

• 辛醇/水分配系数(LogP)：
  0.11
• 重原子数：
  16
• 可旋转键数：
  6
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.57
• 拓扑面积：
  0
• 氢给体数：
  0
• 氢受体数：
  1

反应信息

• 作为产物：
  描述：

  N,N-二乙基苯乙胺盐酸盐 、 碘乙烷 在 丙酮 作用下， 生成 triethyl-phenethyl-ammonium; iodide
  参考文献：
  名称：

  The Competitive Formation of Different Olefins from Quaternary Amines

  摘要：

  DOI：

  10.1021/ja01122a067

文献信息

• Flame retarding resin composition
  申请人：——

  公开号：US20040077821A1

  公开（公告）日：2004-04-22

  Disclosed is a flame retarding resin composition comprising (A) one or more epoxy resins; (B) a hardener; and (C) a hardening accelerator, wherein the hardener of the component B is a phosphorus-containing compound represented by the following formula (I): 1 wherein each symbol is as defined below. The flame retarding resin composition of the present invention without adding halogen or other flame retardants has high flame retardancy and excellent heat resistance. The flame retarding resin composition of the present invention is suitably useful in the application of thermosetting resins, thermoplastic resins, bonding sheets, composite materials, laminated plates, printed circuit boards, copper foil adhesives, inks used for build-up process, semiconductor molding materials and the like.

  本发明公开了一种阻燃树脂组合物，该组合物包含(A)一种或多种环氧树脂；(B)一种固化剂；以及(C)一种硬化促进剂，其中成分 B 的固化剂是由下式(I)表示的含磷化合物： 1 其中各符号定义如下。本发明的阻燃树脂组合物不添加卤素或其他阻燃剂，具有高阻燃性和优异的耐热性。本发明的阻燃树脂组合物适用于热固性树脂、热塑性树脂、粘合片、复合材料、层压板、印刷电路板、铜箔粘合剂、用于堆积工艺的油墨、半导体成型材料等。
• Halogen-free resin composition
  申请人：——

  公开号：US20040147640A1

  公开（公告）日：2004-07-29

  Disclosed is a halogen-free resin composition comprising: (A) one or more phosphorus-containing epoxy resins; (B) a hardener; (C) a hardening accelerator; (D) a polyphenylene oxide resin; and (E) a filling material, wherein the hardener of component B has the structure represented by the following formula (I): 1 wherein each symbol is as defined above. The halogen-free resin composition of the present invention without adding halogen has excellent heat resistance and flame retardant property, and excellent dielectric property. The halogen-free resin composition of the present invention is particularly useful in the application of bonding sheets, composite materials, laminated plates, printed circuit boards, copper foil adhesives, inks used for build-up process, semiconductor packaging materials and the like.

  所公开的无卤素树脂组合物包括：(A) 一种或多种含磷环氧树脂；(B) 一种固化剂；(C) 一种硬化促进剂；(D) 一种聚苯醚树脂；以及 (E) 一种填充材料，其中成分 B 的固化剂具有下式 (I) 所表示的结构： 1 其中各符号如上定义。本发明的无卤素树脂组合物不添加卤素，具有优异的耐热性和阻燃性，以及优异 的介电性能。本发明的无卤素树脂组合物尤其适用于粘合片、复合材料、层压板、印刷电路板、铜箔粘合剂、用于堆积工艺的油墨、半导体包装材料等。
• Epoxy resin composition for photosemiconductor package
  申请人：——

  公开号：US20040254305A1

  公开（公告）日：2004-12-16

  An epoxy resin composition containing (A) at least two kinds of epoxy resins, wherein the epoxy resin represented by Formula (I) is in an amount of 10 to 90% by weight based on the total amount of the epoxy resins, (B) a hardener and (C) a hardening accelerator is proposed: 1 wherein each formula symbol is defined as in the above specification. The epoxy resin composition proposed in the present invention, which is characterized with excellent light transmittance and heat resistance and low moisture absorption, is particularly useful in packaging photosemiconductor elements.

  本发明提出了一种环氧树脂组合物，该组合物含有(A)至少两种环氧树脂，其中由式(I)代表的环氧树脂的量为环氧树脂总量的 10%至 90%（按重量计），(B)一种固化剂和(C)一种硬化促进剂： 1 其中各式号的定义与上述说明书相同。本发明提出的环氧树脂组合物具有优异的透光性、耐热性和低吸湿性，特别适用于光半导体元件的封装。
• Nador; Gyermek, Acta Chimica Academiae Scientiarum Hungaricae, 1952, vol. 2, p. 95,99
  作者：Nador、Gyermek

  DOI：——

  日期：——
• Flame retardative resin composition
  申请人：Hwang Kuen-Yuan

  公开号：US20080054234A1

  公开（公告）日：2008-03-06

  A nonflammable resin composition comprises (A) at least an epoxy resin with biphenyl unit or naphthyl unit; (B) at least a phenolic resin used as a hardener, wherein the phenolic resin has a skeleton formed by phenyl rings bonding directly each other without interruption, and is in an amount of 30 to 100% by weight based on total hardeners; and (C) a curing catalyst. The said nonflammable resin has an excellent flame retardancy, a good heat resistance, and an improved moldability and reliability.