[3-(3,4-Dimethyl-benzoyl)-phenyl]-(3,4-dimethyl-phenyl)-methanone | 23602-89-3

• 分子结构分类: 有机化合物 - 苯丙烷和聚酮 - 二芳基庚烷
• 英文名称: [3-(3,4-Dimethyl-benzoyl)-phenyl]-(3,4-dimethyl-phenyl)-methanone
• 英文别名: Methanone, 1,3-phenylenebis[(3,4-dimethylphenyl)-；[3-(3,4-dimethylbenzoyl)phenyl]-(3,4-dimethylphenyl)methanone
• CAS: 23602-89-3
• 化学式: C₂₄H₂₂O₂
• mdl: MFCD00690136
• 分子量: 342.437
• InChiKey: PSGOXWVPYKKUBA-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  6.1
• 重原子数：
  26
• 可旋转键数：
  4
• 环数：
  3.0
• sp3杂化的碳原子比例：
  0.17
• 拓扑面积：
  34.1
• 氢给体数：
  0
• 氢受体数：
  2

文献信息

• JPH0625079A
  申请人：——

  公开号：JPH0625079A

  公开（公告）日：1994-02-01
• PHOTOSENSITIVE POLYIMIDE HAVING SILICON MODIFIED GROUP, ADHESIVE COMPOSITION AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
  申请人：JEONG Chul Ho

  公开号：US20120135251A1

  公开（公告）日：2012-05-31

  A photosensitive polyimide and an adhesive composition and adhesive film containing the same are provided. The photosensitive polyimide has an imide backbone and grafted side chains including a methacrylate-based side chain and a silicon-modified side chain.
• COMPOUND FOR SEMICONDUCTOR PACKAGE, PHOTOSENSITIVE RESIN COMPOSITION INCLUDING THE SAME AND SEMICONDUCTOR PACKAGE STRUCTURE THEREOF
  申请人：GTA ELECTRONICS CO., LTD.

  公开号：US20160187776A1

  公开（公告）日：2016-06-30

  A compound represented by Formula 1, a photosensitive resin composition including the compound represented by Formula 1, and a semiconductor package structure using the photosensitive resin are disclosed, wherein the Formula 1 is as follows, and n is an integer of 1 to 15:
• US7157548B2
  申请人：——

  公开号：US7157548B2

  公开（公告）日：2007-01-02