申请人:Hitachi Chemical Company, Ltd.
公开号:US10037894B2
公开(公告)日:2018-07-31
The present invention relates to a metal polishing liquid for polishing at least a part of metal in a substrate having the metal, comprising, component A: a metal solubilizer containing amino acids, component B: compounds having the benzotriazole skeleton, and component C: an acrylic acid polymer having the weight average molecular weight of 10,000 or more, and having the mass ratio between the component B and the component C, (component B:component C), to be 1:1 to 1:5. Use of the metal polishing liquid can simultaneously yield high polishing rates and low etching rates at higher level, enabling to form an embedded pattern with higher reliability.
本发明涉及一种金属抛光液,用于对具有金属的基体中的至少部分金属进行抛光,该抛光液由以下组分组成:组分 A:含有氨基酸的金属增溶剂;组分 B:具有苯并三唑骨架的化合物;以及组分 C:重量平均分子量在 10,000 或以上的丙烯酸聚合物,且组分 B 与组分 C 之间的质量比(组分 B:组分 C)为 1:1 至 1:5。使用金属抛光液可同时获得较高的抛光率和较低的蚀刻率,从而形成可靠性更高的嵌入图案。