2-Methyl-2H-cyclopentapyridazin | 22291-85-6

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 二嗪类
• 英文名称: 2-Methyl-2H-cyclopentapyridazin
• 英文别名: 2-Methyl-2H-cyclopenta[d]pyridazine；3-methylcyclopenta[d]pyridazine
• CAS: 22291-85-6
• 化学式: C₈H₈N₂
• 分子量: 132.165
• InChiKey: BIMGWGYFPBTJLU-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  1.2
• 重原子数：
  10
• 可旋转键数：
  0
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.12
• 拓扑面积：
  17.8
• 氢给体数：
  0
• 氢受体数：
  1

反应信息

• 作为反应物：
  描述：

  2-Methyl-2H-cyclopentapyridazin 生成 5,7-diiodo-2-methyl-2H-cyclopenta[d]pyridazine
  参考文献：
  名称：

  ANDERSON JR. A. G.; FORKEY D. M.; GRINA L. D.; HICKERNELL L. W.; TOBER T.+, J. ORG. CHEM. , 1975, 40, NO 15, 2196-2200

  摘要：

  DOI：

文献信息

• [EN] PROCESS FOR PREPARATION OF ALUMINUM SALT OF PHOSPHONIC ACID ESTER<br/>[FR] PROCÉDÉ DE PRÉPARATION D'UN SEL D'ALUMINIUM D'UN ESTER D'ACIDE PHOSPHONIQUE
  申请人：ICL IP AMERICA INC

  公开号：WO2013077989A1

  公开（公告）日：2013-05-30

  There is provided herein a process for the preparation of aluminum salts of phosphonic acid esters by reacting phosphonic acid diesters with aluminum hydroxide in the presence of a catalyst. The catalyst is selected from the group consisting of a phase transfer catalyst, a thermally stable tertiary amine having a boiling point higher than about 140°C, a thermally stable tertiary phosphine having a boiling point higher than 140°C and combinations thereof. The aluminum phosphonates prepared can be used for making flame retarded thermoplastic polymers.

  本文提供了一种制备磷酸酯铝盐的方法，通过在催化剂存在下将磷酸二酯与氢氧化铝反应。催化剂选自相转移催化剂、热稳定的沸点高于约140°C的三级胺、热稳定的沸点高于140°C的三级膦和它们的组合。制备的铝磷酸盐可用于制备阻燃热塑性聚合物。
• Use of a catalyst in epoxy compositions
  申请人：THE DOW CHEMICAL COMPANY

  公开号：EP0328020A2

  公开（公告）日：1989-08-16

  Storage stable compositions are disclosed which comprise an epoxide containing compound, a phenolic hydroxyl containing compound, and a catalyst compound for catalyzing the reaction between epoxide groups and aromatic hydroxyl groups which catalyst comprises the product resulting from contacting an onium compound, non-heterocyclic amine compound, heterocyclic nitrogen compound or salt thereof with an acid or a salt of an acid having a weak nucleophilic anion.

  本发明公开了一种贮存稳定的组合物，该组合物包括一种含环氧化物的化合物、一种含酚羟基的化合物和一种催化环氧化物基团与芳香羟基基团反应的催化剂化合物，该催化剂包括鎓化合物、非杂环胺化合物、杂环氮化合物或其盐与酸或具有弱亲核阴离子的酸的盐接触后产生的产物。
• Latent catalysts, cure-inhibited epoxy resin compositions and laminates prepared therefrom
  申请人：THE DOW CHEMICAL COMPANY

  公开号：EP0458502A2

  公开（公告）日：1991-11-27

  In summary, the application is related to the discovery of a class of compounds which comprises boric acid or maleic acid or a mixture of boric acid with at least one acid having a weak nucleophilic anion, which inhibits the reaction of a polyepoxide with a curing agent at low temperatures. In another embodiment the application is a latent catalyst system adapted for curing a polyepoxide resulting from contacting I) a catalyst for the cure of a polyepoxide compound comprising an amine, heterocyclic nitrogen phosphine, sulfide, phosphine, sulfide, ammonium, phosphonium, sulfonium, arsonium, containing compound or a mixture thereof; with II) boric acid, or a mixture of boric acid with at least an acid having a weak nucleophilic anion. Further the application relates to epoxy resin compositions containing the inhibitor or latent catalytic composition. In still another embodiment the application relates to a composition useful for curing a polyepoxide which contains: A) an inhibiting amount of boric acid or maleic acid or a mixture of boric acid with at least one acid having a weak nucleophilic anion; and optionally B) a catalytic amount of a catalyst useful for accelerating the reaction of a polyepoxide with the curing agent, wherein the inhibitor and catalyst may be present in complex form.

  总之，本申请涉及一类化合物的发现，该化合物由硼酸或马来酸或硼酸与至少一种具有弱亲核阴离子的酸的混合物组成，在低温下可抑制聚环氧化物与固化剂的反应。在另一个实施方案中，本申请涉及一种潜伏催化剂系统，该系统适用于固化聚环氧乙烷，该固化聚环氧乙烷化合物的催化剂包括胺、杂环含氮膦、硫化物、膦、硫化物、铵、鏻、锍、胂、含化合物或其混合物；与 I) 硼酸或硼酸与至少一种具有弱亲核阴离子的酸的混合物接触后产生的聚环氧乙烷。此外，本申请还涉及含有抑制剂或潜在催化成分的环氧树脂组合物。在另一个实施方案中，本申请涉及一种用于固化聚环氧树脂的组合物，该组合物含有A) 抑制量的硼酸或马来酸或硼酸与至少一种具有弱亲核阴离子的酸的混合物；以及 B) 催化量的催化剂，用于加速聚环氧化物与固化剂的反应，其中抑制剂和催化剂可以复合物形式存在。
• Catalysts and epoxy resin composition containing the same
  申请人：THE DOW CHEMICAL COMPANY

  公开号：EP0553887A2

  公开（公告）日：1993-08-04

  Storage stable compositions are disclosed which comprise an epoxide containing compound, a phenolic hydroxyl containing compound, and a catalyst compound for catalyzing the reaction between epoxide groups and aromatic hydroxyl groups which catalyst comprises the product resulting from contacting an onium compound, non-heterocyclic amine compound, heterocyclic nitrogen compound or salt thereof with an acid or a salt of an acid having a weak nucleophilic anion.

  本发明公开了一种贮存稳定的组合物，该组合物包括一种含环氧化物的化合物、一种含酚羟基的化合物和一种催化环氧化物基团与芳香羟基基团反应的催化剂化合物，该催化剂包括鎓化合物、非杂环胺化合物、杂环氮化合物或其盐与酸或具有弱亲核阴离子的酸的盐接触后产生的产物。
• Via fill compositions for direct attach of devices and methods for applying same
  申请人：International Business Machines Corporation

  公开号：EP0653904A2

  公开（公告）日：1995-05-17

  The present invention permits solder joints to be made directly to via and through holes without the solder being wicked into the vias or through holes, by filling plated through holes (14) with an epoxy or cyanate fill composition (16). When cured and overplated, the fill composition (16) provides support for the solder joint (22) and provides a flat solderable surface (18) for the inter-connection. In certain embodiments, the cured fill compositions, offer a further advantage of being conductive. The invention also relates to several novel methods for filling through holes with such fill compositions, and to resistors located in through holes and vias.

  本发明通过用环氧树脂或氰酸酯填充组合物（16）填充电镀通孔（14），可直接在通孔和通孔上形成焊点，而无需将焊料泼洒到通孔或通孔中。当固化和过镀时，填充成分 (16) 可为焊点 (22) 提供支撑，并为互连提供平整的可焊表面 (18)。在某些实施例中，固化的填充组合物还具有导电的优点。本发明还涉及几种用这种填充组合物填充通孔的新方法，以及位于通孔和过孔中的电阻器。