POSITIVE PHOTOSENSITIVE RESIN COMPOSITION AND METHOD OF FORMING CURED FILM FROM THE SAME
申请人:FUJIFILM Corporation
公开号:EP2261737A1
公开(公告)日:2010-12-15
A positive photosensitive resin composition comprising a resin containing a specified acrylic acid besed-structural unit which generates a carboxyl group when its dissociative group is dissociated, which resin is insoluble in alkali or sparingly soluble in alkali but when its acid-dissociative group is dissociated, becomes soluble in alkali, a resin containing a structural unit derived from a radical-polymerizable monomer containing an epoxy group, a compound containing two or more epoxy groups in its molecule, provided that the resin containing the structural unit derived from a radical-polymerizable monomer containing an epoxy group is not included in this compound, and a compound that when exposed to actinic rays of 300 nm or longer wavelength, generates an acid, and a method of forming cured film from the positive photosensitive resin composition.
一种正性感光树脂组合物,包括一种含有特定丙烯酸旁链结构单元的树脂,当其离解基离解时会产生一个羧基,该树脂不溶于碱或很少溶于碱,但当其酸离解基离解时会溶于碱;一种含有从含有环氧基的可自由基聚合单体衍生的结构单元的树脂、在其分子中含有两个或两个以上环氧基团的化合物,但该化合物中不包括含有由含有环氧基团的可自由基聚合单体衍生的结构单元的树脂,以及当暴露于波长为 300 nm 或更长的辐射线时会产生酸的化合物,以及用正性感光树脂组合物形成固化薄膜的方法。