CURABLE COMPOSITIONS AND THERMOSETS PREPARED THEREFROM
申请人:Dow Global Technologies LLC
公开号:US20150183923A1
公开(公告)日:2015-07-02
A curable composition comprising (a) at least one low viscosity epoxide resin compound having the following chemical structure: (I) wherein R
1
and R
2
are hydrogen or a hydrocarbon group having from 1 to 20 carbon atoms, with the proviso that R
1
and R
2
are not both hydrogen, and (b) at least one curing agent or UV photoinitiator; and a thermoset prepared from the above curable composition.
NOVEL EPOXIDE COMPOUND
申请人:Dow Global Technologies LLC
公开号:US20150225359A1
公开(公告)日:2015-08-13
A novel low viscosity epoxide having the following general Structure (I): Structure (I) wherein R1 and R2 can be, but is not limited to, hydrogen or a hydrocarbon group having from C1 to about C20 carbon atoms; with the proviso that R1 and R2 are not both hydrogen.