2-[1-(4-Dimethylamino-phenyl)-meth-(E)-ylidene]-6-[1-(4-dimethylamino-phenyl)-meth-(Z)-ylidene]-4-methyl-cyclohexanone | 65446-46-0

• 分子结构分类: 有机化合物 - 苯丙烷和聚酮 - 二芳基庚烷
• 英文名称: 2-[1-(4-Dimethylamino-phenyl)-meth-(E)-ylidene]-6-[1-(4-dimethylamino-phenyl)-meth-(Z)-ylidene]-4-methyl-cyclohexanone
• 英文别名: (2Z,6E)-2,6-bis[[4-(dimethylamino)phenyl]methylidene]-4-methylcyclohexan-1-one
• CAS: 65446-46-0
• 化学式: C₂₅H₃₀N₂O
• 分子量: 374.526
• InChiKey: YXQINXKZKRYRQM-ICZBVKINSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  5.6
• 重原子数：
  28
• 可旋转键数：
  4
• 环数：
  3.0
• sp3杂化的碳原子比例：
  0.32
• 拓扑面积：
  23.6
• 氢给体数：
  0
• 氢受体数：
  3

文献信息

• CERAMIC GREEN SHEET
  申请人：TORAY INDUSTRIES, INC.

  公开号：EP0602252A1

  公开（公告）日：1994-06-22

  A ceramic green sheet used suitably for the formation of a sintered ceramic substrate, which contains a ceramic powder and a photosensitive resin composition. Fine via-holes and through-holes of accurate size can be formed in the green sheet easily, reliably and economically.

  一种适用于形成烧结陶瓷基板的陶瓷绿片，它包含陶瓷粉末和光敏树脂成分。在这种绿色薄片上可以轻松、可靠、经济地形成尺寸精确的细孔和通孔。
• PHOTOSENSITIVE PASTE, PLASMA DISPLAY, AND PROCESS FOR THE PRODUCTION THEREOF
  申请人：TORAY INDUSTRIES, INC.

  公开号：EP0775940A1

  公开（公告）日：1997-05-28

  To provide a photosensitive paste that permits pattern formation with a high aspect ratio and a high accuracy and to provide a plasma display comprising said photosensitive paste, by using a photosensitive paste that comprises, as essential components, an inorganic particles and an organic component that contains a photosensitive compound with the difference between the average refractive index of the organic component and the average refractive index of the inorganic particles being 0.1 or less.

  提供一种可形成高纵横比和高精度图案的光敏浆料，并提供一种由所述光敏浆料组成的等离子显示器，该光敏浆料的主要成分包括无机颗粒和含有光敏化合物的有机成分，其中有机成分的平均折射率与无机颗粒的平均折射率之差不超过 0.1。
• HIGHLY HEAT-RESISTANT, NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION
  申请人：Asahi Kasei EMD Corporation

  公开号：EP1536286A1

  公开（公告）日：2005-06-01

  Disclosed is a negative type photosensitive resin composition comprising (A) a polyamide having a photopolymerizable unsaturated double bond, (B) a monomer having a photopolymerizable unsaturated double bond, (C) a photopolymerization initiator and (D) a melamine resin.

  本发明公开了一种负型感光树脂组合物，该组合物包括：(A) 具有可进行光聚合的不饱和双键的聚酰胺；(B) 具有可进行光聚合的不饱和双键的单体；(C) 光聚合引发剂；(D) 三聚氰胺树脂。
• PHOTOSENSITIVE COMPOSITION, DISPLAY MEMBER, AND PROCESS FOR PRODUCING THE SAME
  申请人：TORAY INDUSTRIES, INC.

  公开号：EP1980910A1

  公开（公告）日：2008-10-15

  Disclosed is a photosensitive composition comprising 50 to 5% by weight of a photosensitive organic component and 50 to 95% by weight of a glass powder, wherein the glass powder contains 70 to 85% by weight of Bi2O3, 3 to 15% by weight of SiO2, 5 to 20% by weight of B2O3, 0 to 3% by weight of ZrO2 and 1 to 10% by weight of ZnO, expressed in terms of oxide. The present invention provides a photosensitive composition which enables fine pattern work by photolithography to be used in various members of a flat panel display and a fluorescence emission tube.

  本发明公开了一种光敏组合物，该组合物包括50-5%（重量）的光敏有机组分和50-95%（重量）的玻璃粉，其中玻璃粉含有70-85%（重量）的Bi2O3、3-15%（重量）的SiO2、5-20%（重量）的B2O3、0-3%（重量）的ZrO2和1-10%（重量）的ZnO，以氧化物表示。 本发明提供了一种光敏组合物，它可以在平板显示器和荧光发射管的各种部件中使用光刻技术进行精细图案加工。
• METHOD FOR PRODUCING POWDER PARTICLE BY USING GRINDING MEDIUM
  申请人：TORAY INDUSTRIES, INC.

  公开号：EP1990095A1

  公开（公告）日：2008-11-12

  The present invention provides a producing method of powder particles having an average particle diameter on the order of submicrons. Specifically, the producing method is a producing method of powder particles obtained by grinding a product to be ground by using plural grinding media, wherein the grinding media including at least one kind (grinding medium A) having an average particle diameter of 0.01 to 5 times and at least one kind (grinding medium B) having an average particle diameter of 10 to 450 times, with respect to the average particle diameter of the product to be ground before being ground, are used.

  本发明提供了一种平均颗粒直径在亚微米数量级的粉末颗粒的生产方法。具体地说，该生产方法是通过使用多个研磨介质研磨待磨产品而获得的粉末颗粒的生产方法，其中使用的研磨介质包括至少一种（研磨介质 A），其平均颗粒直径为研磨前待磨产品平均颗粒直径的 0.01 至 5 倍，以及至少一种（研磨介质 B），其平均颗粒直径为 10 至 450 倍。