Cyclopentylene compound and intermediate thereof, epoxy resin composition, molding material, and resin-encapsulated electronic device
申请人:Hitachi Chemical Company, Ltd.
公开号:US20020065386A1
公开(公告)日:2002-05-30
This invention provides, as a novel compound suited as an encapsulating material for electronic devices, having a high Tg, being low moisture-absorptive, having a high adhesion and being rich in fluidity, a cyclopentylene compound represented by Formula (I) and its intermediate cyclopentenyl compound represented by Formula (III). In the formula, m is 0 or more, Ar
1
and Ar
2
are each a phenol residual group, a naphthol residual group or a fluorene derivative residual group, and each contain a hydroxyl group or a glycidyloxyl group.
1
This invention also provides a resin composition and a molding material which contain the cyclopentylene compound of Formula (I), and an electronic device encapsulated with the molding material.