It is an object of the invention to provide a curable resin composition excellent in mechanical strength, heat resistance, moisture resistance, flexibility, resistance to thermal cycles, resistance to solder reflow, dimensional stability, and the like after curing and providing high adhesion reliability and conduction reliability and an adhesive epoxy resin paste, an adhesive epoxy resin sheet, a conductive connection paste, and a conductive connection sheet using the curable resin composition, and an electronic component joined body.
The invention relates to a curable resin composition, which contains an epoxy resin, a solid polymer having a functional group to react with the epoxy group and a curing agent for an epoxy resin, no phase separation structure being observed in a matrix of a resin when a cured product is dyed with a heavy metal and observed with a transmission electron microscope.
本发明的目的是提供一种固化后机械强度、耐热性、防潮性、柔韧性、耐热循环性、耐焊料回流性、尺寸稳定性等性能优异,并具有高粘接可靠性和传导可靠性的可固化
树脂组合物,以及使用该可固化
树脂组合物的粘接环氧
树脂浆料、粘接环氧
树脂片、导电连接浆料和导电连接片,以及电子元件连接体。
本发明涉及一种可固化
树脂组合物,它包含环氧
树脂、具有与环氧基反应的官能团的固体聚合物和环氧
树脂固化剂,当用重
金属对固化产品进行染色并用透射电子显微镜观察时,在
树脂基体中不会观察到相分离结构。