There is provided a resist underlayer film forming composition for lithography for forming a resist underlayer film capable of being used as a hardmask. A resist underlayer film forming composition for lithography comprising a silane compound containing an anion group, wherein the silane compound containing an anion group is a hydrolyzable organosilane in which an organic group containing an anion group is bonded to a silicon atom and the anion group forms a salt structure, a hydrolysis product thereof, or a hydrolysis-condensation product thereof. The anion group may be a carboxylic acid anion, a phenolate anion, a sulfonic acid anion, or a phosphonic acid anion. The hydrolyzable organosilane may be a compound of Formula (1): R
1
a
R
2
b
Si(R
3
)
4−(a+b)
(1). A composition comprising a mixture of a hydrolyzable organosilane of Formula (1), and at least one organic silicon compound selected from the group consisting of a compound of Formula (2): R
4
a
Si(R
5
)
4−a
(2) and a compound of Formula (3): [R
6
c
Si(R
7
)
3−c
]
2
Y
b
(3); a hydrolysis product of the mixture; or a hydrolysis-condensation product of the mixture.
提供了一种用于光刻的抗蚀底层膜形成组合物,用于形成可用作硬膜的抗蚀底层膜。该抗蚀底层膜形成组合物包括含有阴离子基团的
硅烷化合物,其中含有阴离子基团的
硅烷化合物是一种可
水解的有机
硅烷,其中含有阴离子基团的有机基团与
硅原子键合,阴离子基团形成盐结构,其
水解产物或
水解缩合产物。阴离子基团可以是
羧酸阴离子、
酚酸盐阴离子、
磺酸盐阴离子或
磷酸盐阴离子。可
水解的有机
硅烷可以是式(1)的化合物:R1aR2bSi(R3)4−(a+b)(1)。组合物包括式(1)的可
水解有机
硅烷的混合物,以及选择自化合物组中的至少一种
有机硅化合物的混合物,该组具有式(2)的化合物:R4aSi(R5)4−a(2)和式(3)的化合物:[R6cSi(R7)3−c] 2Yb(3);该混合物的
水解产物;或该混合物的
水解缩合产物。