COMPOSITION AND METHOD FOR MICRO ETCHING OF COPPER AND COPPER ALLOYS
申请人:Tews Dirk
公开号:US20130056438A1
公开(公告)日:2013-03-07
Disclosed is a composition for and applying said method for micro etching of copper or copper alloys during manufacture of printed circuit boards. Said composition comprises a copper salt, a source of halide ions, a buffer system and a benzothiazole compound as an etch refiner. The inventive composition and method is especially useful for manufacture of printed circuit boards having structural features of ≦100 μm.
Anthelmintic quaternary salts. III. Benzothiazolium salts
作者:David L. Garmaise、Gerard Y. Paris、Jacqueline Komlossy、C. H. Chambers、R. C. McCrae