LOW LOSS DIELECTRIC MATERIAL FOR PRINTED CIRCUIT BOARDS AND INTEGRATED CIRCUIT CHIP PACKAGING
申请人:E.I. DU PONT DE NEMOURS AND COMPANY
公开号:EP1500315A1
公开(公告)日:2005-01-26
US6222065B1
申请人:——
公开号:US6222065B1
公开(公告)日:2001-04-24
[EN] LOW LOSS DIELECTRIC MATERIAL FOR PRINTED CIRCUIT BOARDS AND INTEGRATED CIRCUIT CHIP PACKAGING<br/>[FR] MATERIAU DIELECTRIQUE A FAIBLE PERTE POUR PLAQUETTES DE CIRCUITS IMPRIMES ET MISE SOUS BOITIER DE MICROCIRCUITS INTEGRES
申请人:DU PONT
公开号:WO2003092342A1
公开(公告)日:2003-11-06
Disclosed are fiber reinforced composite substrates comprising a polymeric matrix and one or more woven or non-woven para-aramid or fiberglass fabrics, sheets, or papers, said polymeric matrix consisting essentially of one or more cross-linked copolymers of monovinyl aromatic hydrocarbons and conjugated dienes useful for printed circuit boards and cards suitable for use in high frequency circuits.
Moro, Gazzetta Chimica Italiana, 1896, vol. 26 I, p. 105