The present invention provides a metal alkoxide compound having physical properties suitable for a material for forming thin films by CVD, and particularly, a metal alkoxide compound having physical properties suitable for a material for forming metallic-copper thin films. Specifically, the present invention provides a metal alkoxide compound represented by general formula (I), and a thin-film-forming material including the metal alkoxide compound. (In the formula, R1 represents a methyl group or an ethyl group, R2 represents a hydrogen atom or a methyl group, R3 represents a C1-3 linear or branched alkyl group, M represents a metal atom or a silicon atom, and n represents the valence of the metal atom or silicon atom.
本发明提供了一种
金属氧化烷化合物,其物理性质适用于通过 CVD 形成薄膜的材料,特别是一种
金属氧化烷化合物,其物理性质适用于形成
金属
铜薄膜的材料。具体地说,本发明提供了一种由通式(I)表示的
金属氧化烷化合物,以及一种包括该
金属氧化烷化合物的成膜材料。(式中:R1 代表甲基或乙基,R2 代表氢原子或甲基,R3 代表 C1-3 直链或支链烷基,M 代表
金属原子或
硅原子,n 代表
金属原子或
硅原子的价。