POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT
申请人:Shin-Etsu Chemical Co., Ltd.
公开号:EP3896521A1
公开(公告)日:2021-10-20
Provided is a polymer that can be used as a base resin for a positive photosensitive resin composition and a negative photosensitive resin composition, wherein the positive photosensitive resin composition and the negative photosensitive resin composition are soluble in an aqueous alkaline solution, can form a fine pattern, can achieve high resolution, and have good mechanical properties even when they are cured at low temperature. Also provided are a positive photosensitive resin composition and a negative photosensitive resin composition using the polymer. The polymer is represented by general formulas (1) and/or (2):
wherein T1 and T2 may be the same as, or different from, each other and represent any of -CO- and -SO2-; X1 is a tetravalent organic group; and 1 is 0 or 1; and X2 is a divalent organic group.
本发明提供了一种聚合物,可用作正感光树脂组合物和负感光树脂组合物的基础树脂,其中正感光树脂组合物和负感光树脂组合物可溶于碱性水溶液,可形成精细图案,可实现高分辨率,即使在低温下固化也具有良好的机械性能。此外,还提供了使用该聚合物的正感光树脂组合物和负感光树脂组合物。该聚合物由通式(1)和/或(2)表示:
其中 T1 和 T2 可以彼此相同或不同,并代表 -CO- 和 -SO2- 中的任何一种;X1 是四价有机基团;1 是 0 或 1;X2 是二价有机基团。