(E)-2-(ethoxycarbonyloxyimino)-1-phenylpropan-1-one

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: (E)-2-(ethoxycarbonyloxyimino)-1-phenylpropan-1-one
• 英文别名: ethyl [(Z)-(1-oxo-1-phenylpropan-2-ylidene)amino] carbonate
• 化学式: C₁₂H₁₃NO₄
• 分子量: 235.24
• InChiKey: YDMWUMUNUXUYKT-LCYFTJDESA-N

计算性质

• 辛醇/水分配系数(LogP)：
  2.4
• 重原子数：
  17
• 可旋转键数：
  6
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.25
• 拓扑面积：
  65
• 氢给体数：
  0
• 氢受体数：
  5

文献信息

• Photosensitive resin composition, cured pattern production method, cured product, interlayer insulating film, cover coat layer, surface protective layer, and electronic component
  申请人：HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD.

  公开号：US11226560B2

  公开（公告）日：2022-01-18

  A photosensitive resin composition comprising the following component (a), component (b1), and component (b2). (a) a polyimide precursor having a structural unit represented by the following formula (1); (b1) one or more compounds selected from the group consisting of a compound represented by the following formula (11) and a compound represented by the following formula (12); (b2) one or more compounds selected from the group consisting of a compound represented by the following formula (21) and a compound represented by the following formula (22).

  一种光敏树脂组合物，由以下组分(a)、组分(b1)和组分(b2)组成。(a) 具有下式（1）所代表结构单元的聚酰亚胺前体； (b1) 一种或多种选自下式（11）所代表化合物和下式（12）所代表化合物组成的化合物组； (b2) 一种或多种选自下式（21）所代表化合物和下式（22）所代表化合物组成的化合物组。
• PHOTOSENSITIVE RESIN COMPOSITION, CURED PATTERN PRODUCTION METHOD, CURED PRODUCT, INTERLAYER INSULATING FILM, COVER COAT LAYER, SURFACE PROTECTIVE LAYER, AND ELECTRONIC COMPONENT
  申请人：HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD.

  公开号：US20200041900A1

  公开（公告）日：2020-02-06

  A photosensitive resin composition comprising the following component (a), component (b1), and component (b2). (a) a polyimide precursor having a structural unit represented by the following formula (1); (b1) one or more compounds selected from the group consisting of a compound represented by the following formula (11) and a compound represented by the following formula (12); (b2) one or more compounds selected from the group consisting of a compound represented by the following formula (21) and a compound represented by the following formula (22).
• PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED CURED FILM, CURED FILM, INTERLAYER INSULATING FILM, COVER COAT LAYER, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT
  申请人：HD MICROSYSTEMS, LTD.

  公开号：US20210311390A1

  公开（公告）日：2021-10-07

  A photosensitive resin composition comprising: (A) a polyimide precursor having a polymerizable unsaturated bond; (B) one or more selected from compounds represented by any of the following formulas (1) to (4); and (C) a photopolymerization initiator represented by the following formula (11), wherein in the formulas (1) to (4), R 1 , R 2 , and R 8 are independently an alkyl group including 1 to 4 carbon atoms, and R 3 to R 7 are independently a hydrogen atom, or an alkyl group including 1 to 4 carbon atoms; s is an integer of 0 to 8; t is an integer of 0 to 4; r is an integer of 0 to 4; and in the formula (11), R 11 is an alkyl group including 1 to 12 carbon atoms, an alkoxy group including 1 to 12 carbon atoms, a cycloalkyl group including 4 to 10 carbon atoms, a phenyl group, or a tolyl group; R 12 is an alkyl group including 1 to 12 carbon atoms, a cycloalkyl group including 4 to 10 carbon atoms, a phenyl group, or a tolyl group; and R 13 is a substituted or unsubstituted benzoyl group, a substituted or unsubstituted fluorenyl group, or a substituted or unsubstituted carbazolyl group.
• PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING PATTERNED CURED PRODUCT, CURED PRODUCT, INTERLAYER INSULATING FILM, COVER COAT LAYER, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT
  申请人：HD MICROSYSTEMS, LTD.

  公开号：US20210382391A1

  公开（公告）日：2021-12-09

  A photosensitive resin composition comprising (A) a polyimide precursor having a polymerizable unsaturated bond; (B) a polymerizable monomer; (C) a photopolymerization initiator; and (D) an ultraviolet absorber.
• [EN] PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED CURED FILM, CURED FILM, INTERLAYER INSULATING FILM, COVER COAT LAYER, SURFACE PROTECTION FILM, AND ELECTRONIC COMPONENT<br/>[FR] COMPOSITION DE RÉSINE PHOTOSENSIBLE, PROCÉDÉ DE PRODUCTION DE FILM DURCI À MOTIF, FILM DURCI, FILM ISOLANT INTERCOUCHE, COUCHE DE REVÊTEMENT DE RECOUVREMENT, FILM DE PROTECTION DE SURFACE ET COMPOSANT ÉLECTRONIQUE<br/>[JA] 感光性樹脂組成物、パターン硬化膜の製造方法、硬化膜、層間絶縁膜、カバーコート層、表面保護膜及び電子部品
  申请人：HD MICROSYSTEMS LTD

  公开号：WO2021215374A1

  公开（公告）日：2021-10-28

  （Ａ）重合性の不飽和結合を有するポリイミド前駆体、（Ｂ）脂肪族環状骨格を有する重合性モノマー、（Ｃ）光重合開始剤、及び（Ｄ）テトラゾール及びテトラゾール誘導体からなる群から選択される１以上の化合物を含有する感光性樹脂組成物。